Imaging element, electronic device, and information processing device

ABSTRACT

The present disclosure relates to an imaging element, an electronic device, and an information processing device capable of more easily providing a wider variety of photoelectric conversion outputs. 
     An imaging element of the present disclosure includes: a photoelectric conversion element layer containing a photoelectric conversion element that photoelectrically converts incident light; a wiring layer formed in the photoelectric conversion element layer on the side opposite to a light entering plane of the incident light, and containing a wire for reading charges from the photoelectric conversion element; and a support substrate laminated on the photoelectric conversion element layer and the wiring layer, and containing another photoelectric conversion element. The present disclosure is applicable to an imaging element, an electronic device, and an information processing device.

TECHNICAL FIELD

The present disclosure relates to an imaging element, an electronicdevice, and an information processing device, and more particularly toan imaging element, an electronic device, and an information processingdevice capable of more easily providing a wider variety of photoelectricconversion outputs.

BACKGROUND ART

The penetration length of Infrared light for silicon (Si) is long. Thus,in manufacturing a supersensitive sensor which utilizes near infraredlight, a long optical length needs to be formed within silicon.Moreover, photoelectric conversion occurs at a deep position from thesilicon surface corresponding to light entrance plane; therefore, apotential for storing electrons needs to be formed at a deep position.

For forming a potential at a deep position, ultra-high energyion-implantation (ion implantation) is needed according to conventionalmethods. In this case, development cost and manufacturing costconsiderably increase depending on situations. In addition, developmentof a suitable resist is also demanded, and thus the level of difficultdevelopment may further increase.

For overcoming this problem, a method has been developed where ion isimplanted from both a front surface and a rear surface of a siliconsubstrate to form photo diodes located at a deep position and capable ofstoring sufficient electrons obtained by photoelectric conversion ofinfrared light (i.e., a method not requiring ultra-high energy ionimplantation) (for example, see Patent Document 1).

According to this method, ion is initially implanted from the frontsurface of the silicon substrate to form a photo diode in the surface ofthe silicon substrate at a depth equivalent to the depth of an imagesensor handling visible light. Then, the silicon substrate is turnedover to polish the rear surface of the silicon substrate. Thereafter,ion is implanted from the rear surface of the substrate to form a photodiode at a depth equivalent to the depth of the image sensor handlingvisible light. This manufacturing method forms a photoelectricconversion area having a doubled depth at the maximum in the depthdirection without the necessity of ultra-high energy ion implantation.

The turned over silicon substrate is polished to a necessary filmthickness. After ion implantation, the polished silicon substrate isjoined with a support substrate for supporting the thickness of thesilicon after the polishing. Then, an impurity having been ion-implantedfrom the rear surface of the silicon substrate is activated byhigh-temperature activation processing.

CITATION LIST Patent Document

Patent Document 1: Japanese Patent Application Laid-Open No. 2010-192483

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

However, the method disclosed in Patent Document 1 only improves thephotoelectric conversion efficiency for a long wavelength region.Accordingly, this method does not provide a plurality of photoelectricconversion outputs for one pixel; therefore, it is difficult to be usedin a variety of applications. Moreover, in the manufacture using themethod described in Patent Document 1, an activation processing needs tobe performed for activating the impurity ion-implanted from the rearsurface of the silicon substrate so as to avoid breakage of junctionbetween the silicon substrate and the support substrate. This activationprocessing requires special facilities for performing laser annealing orthe like capable of completing thermal processing in a short period andnot imposing thermal effect on a junction interface. Accordingly, themanufacturing cost of this method considerably increases.

The present disclosure has been developed to cope with theaforementioned situations. It is an object of the present disclosure toprovide a technology capable of offering a result of photoelectricconversion of components in a plurality of different wavelength regionsof incident light for one pixel, and more easily providing a widervariety of photoelectric conversion outputs.

Solutions to Problems

An imaging element according to an aspect of the present disclosureincludes: a photoelectric conversion element layer containing aphotoelectric conversion element that photoelectrically convertsincident light; a wiring layer formed in the photoelectric conversionelement layer on the side opposite to a light entering plane of theincident light, and containing a wire for reading charges from thephotoelectric conversion element; and a support substrate laminated onthe photoelectric conversion element layer and the wiring layer, andcontaining another photoelectric conversion element.

The photoelectric conversion element of the photoelectric conversionelement layer, and the photoelectric conversion element of the supportsubstrate may photoelectrically convert components in differentwavelength regions of the incident light.

The photoelectric conversion element of the photoelectric conversionelement layer may photoelectrically convert components in a visiblelight wavelength region, and the photoelectric conversion element of thesupport substrate may photoelectrically convert components in a nearinfrared light wavelength region.

The thickness of the photoelectric conversion element of thephotoelectric conversion element layer may be different from thethickness of the photoelectric conversion element of the supportsubstrate.

The photoelectric conversion element of the photoelectric conversionelement layer and the photoelectric conversion element of the supportsubstrate may output charges accumulated by photoelectric conversion ofthe incident light at the same timing.

The photoelectric conversion element of the photoelectric conversionelement layer and the photoelectric conversion element of the supportsubstrate may output charges accumulated by photoelectric conversion ofthe incident light at different timing.

The photoelectric conversion element of the photoelectric conversionelement layer and the photoelectric conversion element of the supportsubstrate may output a synthesis image produced by synthesizing an imageobtained in the photoelectric conversion element layer and an imageobtained in the support substrate by outputting charges accumulated byphotoelectric conversion of the incident light.

The charge accumulation time of the photoelectric conversion element ofthe photoelectric conversion element layer for accumulating chargesproduced by photoelectric conversion of the incident light may bedifferent from the corresponding charge accumulation time of thephotoelectric conversion element of the support substrate.

The wire of the wiring layer may be disposed in such a position as tosecure an optical path of incident light transmitted from one of thesides of the wiring layer to the other side.

A waveguide formed by material having a larger refractive index than therefractive index of the surroundings may be provided on the optical pathof the wiring layer.

A light absorber may be provided on the optical path of the wiringlayer.

The support substrate may further include a wire formed on the side ofthe photoelectric conversion element of the support substrate oppositeto the light entering plane of the incident light for reading chargesfrom the photoelectric conversion element of the support substrate. Anexternal terminal of the wire of the wiring layer and an externalterminal of the wire of the support substrate may be connected with eachother by a through via.

When charges read from the photoelectric conversion element of thephotoelectric conversion element layer exceed a predetermined threshold,charges may be read from the photoelectric conversion element of thesupport substrate.

Each of the photoelectric conversion elements may include an organicphotoelectric conversion film.

A white color filter may be further included. The photoelectricconversion element of the photoelectric conversion element layer mayphotoelectrically convert a white component of the incident light havingpassed through the white color filter. The photoelectric conversionelement of the support substrate may photoelectrically convert othercolor components.

Depth information showing a depth to a target may be obtained usinginfrared light photoelectrically converted by the photoelectricconversion elements.

It may be controlled whether data on the incident lightphotoelectrically converted by the photoelectric conversion element ofthe photoelectric conversion element layer and the photoelectricconversion element of the support substrate is individually output oroutput after addition of the data.

The support substrate may include: a photoelectric conversion elementlayer containing the photoelectric conversion element of the supportsubstrate; a wiring layer formed in the photoelectric conversion elementlayer of the support substrate on the side opposite to a light enteringplane of the incident light, and containing a wire for reading chargesfrom the photoelectric conversion element of the support substrate; anda support substrate laminated on the photoelectric conversion elementlayer and the wiring layer, and containing another photoelectricconversion element.

An electronic device according to another aspect of the presentdisclosure include: an imaging element that images a subject andincludes a photoelectric conversion element layer containing aphotoelectric conversion element that photoelectrically convertsincident light, a wiring layer formed in the photoelectric conversionelement layer on the side opposite to a light entering plane of theincident light, and containing a wire for reading charges from thephotoelectric conversion element, and a support substrate laminated onthe photoelectric conversion element layer and the wiring layer, andcontaining another photoelectric conversion element; and an imageprocessing unit that executes image processing using signals generatedby the photoelectric conversion elements of the imaging element.

An information processing device according to a further aspect of thepresent disclosure include: an imaging element that includes aphotoelectric conversion element layer containing a photoelectricconversion element that photoelectrically converts incident light, awiring layer formed in the photoelectric conversion element layer on theside opposite to a light entering plane of the incident light, andcontaining a wire for reading charges from the photoelectric conversionelement, and a support substrate laminated on the photoelectricconversion element layer and the wiring layer, and containing anotherphotoelectric conversion element; and a signal processing unit thatexecutes analysis using signals in a plurality of wavelength bandsgenerated by the photoelectric conversion elements of the imagingelement.

According to an aspect of the present disclosure, there are provided aphotoelectric conversion element layer containing a photoelectricconversion element that photoelectrically converts incident light, awiring layer formed in the photoelectric conversion element layer on theside opposite to a light entering plane of the incident light, andcontaining a wire for reading charges from the photoelectric conversionelement, and a support substrate laminated on the photoelectricconversion element layer and the wiring layer, and containing anotherphotoelectric conversion element.

According to another aspect of the present disclosure, there areprovided an imaging element that images a subject and includes aphotoelectric conversion element layer containing a photoelectricconversion element that photoelectrically converts incident light, awiring layer formed in the photoelectric conversion element layer on theside opposite to a light entering plane of the incident light, andcontaining a wire for reading charges from the photoelectric conversionelement, and a support substrate laminated on the photoelectricconversion element layer and the wiring layer, and containing anotherphotoelectric conversion element, and an image processing unit thatexecutes image processing using signals generated by the photoelectricconversion elements of the imaging element.

According to a further aspect of the present disclosure, an informationprocessing device includes: an imaging element that includes aphotoelectric conversion element layer containing a photoelectricconversion element that photoelectrically converts incident light, awiring layer formed in the photoelectric conversion element layer on theside opposite to a light entering plane of the incident light, andcontaining a wire for reading charges from the photoelectric conversionelement, and a support substrate laminated on the photoelectricconversion element layer and the wiring layer, and containing anotherphotoelectric conversion element; and a signal processing unit thatexecutes analysis using signals in a plurality of wavelength bandsgenerated by the photoelectric conversion elements of the imagingelement.

Effects of the Invention

According to the present disclosure, incident light is photoelectricallyconverted. Particularly, a wider variety of photoelectric conversionoutputs are more easily provided.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a figure illustrating an example of a chief configuration of aconventional CMOS image sensor.

FIG. 2 is a figure illustrating an example of a chief configuration of aCMOS image sensor according to the present technology.

FIG. 3 is a block diagram illustrating an example of a chiefconfiguration of a manufacturing device according to the presenttechnology.

FIG. 4 is a flowchart showing a flow example of a manufacturing process.

FIG. 5 is a figure illustrating another configuration example of theCMOS image sensor according to the present technology.

FIG. 6 is a figure illustrating an example of pupil correction.

FIG. 7 is a figure illustrating a further configuration example of theCMOS image sensor according to the present technology.

FIG. 8 is a figure illustrating a still further configuration example ofthe CMOS image sensor according to the present technology.

FIG. 9 is a figure illustrating a still further configuration example ofthe CMOS image sensor according to the present technology.

FIG. 10 is a figure illustrating a still further configuration exampleof the CMOS image sensor according to the present technology.

FIG. 11 is a block diagram illustrating an example of a chiefconfiguration of an imaging device.

FIG. 12 is a figure illustrating a still further configuration exampleof the CMOS image sensor according to the present technology.

FIG. 13 is a block diagram illustrating another configuration example ofthe manufacturing device according to the present technology.

FIG. 14 is a flowchart showing a flow example of a support substratemanufacturing process.

FIG. 15 is a figure illustrating conditions of the support substratemanufacturing process.

FIG. 16 is a flowchart showing another flow example of the manufacturingprocess.

FIG. 17 is a figure illustrating conditions of the manufacturingprocess.

FIG. 18 is a block diagram showing a further configuration example ofthe manufacturing device according to the present technology.

FIG. 19 is a flowchart showing a further flow example of themanufacturing process.

FIG. 20 is a figure illustrating conditions of the manufacturingprocess.

FIG. 21 is a figure illustrating a still further configuration exampleof the CMOS image sensor according to the present technology.

FIG. 22 is a figure illustrating an example of signal reading.

FIG. 23 is a figure illustrating an example of pixel arrangement.

FIG. 24 is a figure illustrating a configuration example of a lowerlayer.

FIG. 25 is a figure illustrating another example of the pixelarrangement.

FIG. 26 is a figure illustrating an example of positions of formed photodiodes.

FIG. 27 is a block diagram illustrating an example of a chiefconfiguration of an imaging device according to the present technology.

FIG. 28 is a figure illustrating an example of application to medicalequipment.

FIG. 29 is a figure illustrating an example of application to ToF.

FIG. 30 is a figure illustrating an example of application to an imagingmodule.

FIG. 31 is a flowchart showing a flow example of an imaging process.

FIG. 32 is a figure illustrating a further example of the pixelarrangement.

FIG. 33 is a block diagram illustrating another configuration example ofthe imaging device according to the present technology.

FIG. 34 is a figure illustrating an example of sampling intervals.

FIG. 35 is a figure illustrating a configuration example of electrodeconnection.

FIG. 36 is a figure illustrating a still further example of the pixelarrangement.

FIG. 37 is a flowchart showing a flow example of a control process.

FIG. 38 is a figure illustrating an example of application to a portablecommunication terminal.

FIG. 39 is a figure illustrating an example of application to anelectronic device.

FIG. 40 is a figure illustrating an example of application to an imagingdevice.

FIG. 41 is a figure illustrating an example of application to anelectronic device.

FIG. 42 is a flowchart showing a flow example of a control process.

FIG. 43 is a figure illustrating an example of application to an imagingdevice.

FIG. 44 is a figure illustrating an example of application to an inputinterface.

FIG. 45 is a block diagram illustrating an example of application to anelectronic device.

FIG. 46 is a figure illustrating an example of reflection of incidentlight.

MODE FOR CARRYING OUT THE INVENTION

Embodiments for carrying out the present technology (hereinafterreferred to as embodiments) are hereinafter described. The descriptionwill be presented in the following order.

1. First Embodiment (imaging element: rear surface type+front surfacetype)

2. Second Embodiment (manufacturing device and method)

3. Third Embodiment (application example 1: waveguide)

4. Fourth Embodiment (application example 2: pupil correction)

5. Fifth Embodiment (application example 3: PD pitch change)

6. Sixth Embodiment (application example 4: visible light+visible light)

7. Seventh Embodiment (application example 5: rear surface type+rearsurface type)

8. Eighth Embodiment (imaging device)

9. Ninth Embodiment (various application examples)

1. First Embodiment Conventional Imaging Element

Initially, a configuration example of a conventional imaging element isdiscussed. FIG. 1 is a figure illustrating an example of a chiefconfiguration of a conventional CMOS (Complementary Metal OxideSemiconductor) image sensor. A CMOS image sensor 10 illustrated in FIG.1 is a rear surface irradiation type image sensor including CMOS andprovided with an amplifier for each unit cell.

FIG. 1 illustrates a schematic structure of the CMOS image sensor 10 inthe vertical direction (lamination direction) (schematic view of crosssection). As illustrated in FIG. 1, the CMOS image sensor 10 includes acondensing lens 11, a color filter 12, and a photo diode (Photo Diode)15 for each pixel.

FIG. 1 shows four pixels as an effective pixel area of the CMOS imagesensor 10. Photo diode 15-1 to photo diode 15-4 are provided in asemiconductor substrate 14 as components of the four pixels. The photodiodes 15-1 to 15-4 are collectively referred to as photo diodes 15 whendistinction between the respective photo diodes is not needed in thisdescription.

A condensing lens 11-1 and a color filter 12-1 are provided for thephoto diode 15-1. A condensing lens 11-2 and a color filter 12-2 areprovided for the photo diode 15-2. A condensing lens 11-3 and a colorfilter 12-3 are provided for the photo diode 15-3. A condensing lens11-4 and a color filter 12-4 are provided for the photo diode 15-4. Therespective condensing lenses are collectively referred to as condensinglenses 11 when distinction between the respective condensing lenses isnot needed in this description. The respective color filters arecollectively referred to as color filters 12 when distinction betweenthe respective color filters is not needed in this description.

As illustrated in FIG. 1, an insulation film 13 is formed on the rearsurface side of the semiconductor substrate 14 corresponding to a lightentrance plane of the semiconductor substrate 14. The color filters 12and the condensing lenses 11 are provided on the insulation film 13.

On the other hand, a wiring layer 16, a passivation film 19, and asupport substrate 20 are formed on the front surface side of thesemiconductor substrate 14 opposed to the light entrance plane of thesemiconductor substrate 14. The wiring layer 16 includes wires 17 and awire interlayer film 18.

A pad 21 for connecting with a circuit outside the CMOS image sensor 10is provided in the wiring layer in an area out of the effective pixelarea of the CMOS image sensor 10.

When visible light 31 enters the condensing lens 11-2 of the CMOS imagesensor 10 thus constructed, for example, the visible light 31 passesthrough the condensing lens 11-2, the color filter 12-2, and theinsulation film 13, and reaches the photo diode 15-2 to bephotoelectrically converted with high efficiency by the photo diode15-2.

On the other hand, near infrared light 32 has a longer wavelength thanthe wavelength of the visible light 31. In this case, the penetrationlength of the near infrared light 32 for silicon (semiconductorsubstrate 14) becomes longer than the penetration length of the visiblelight 31; therefore, such potential distribution is needed whichcollects electrons photoelectrically converted at a position deeper thanthe position of the visible light 31.

However, according to the rear surface irradiation type such as the CMOSimage sensor 10 illustrated in FIG. 1, the film thickness of thesemiconductor substrate 14 generally needs to decrease to a range fromabout 2 μm to about 3 μm to reduce generation of color mixture. In thiscase, it may become difficult for the photo diode 15-4 to achieveefficient photoelectric conversion of the near infrared light 32 havingpassed through the condensing lens 11-4, the color filter 12-4, and theinsulation film 13 and entered the photo diode 15-4. In other words, itmay become difficult for the rear surface irradiation type CMOS imagesensor 10 to obtain sufficient sensitivity to the near infrared light32.

For increasing the sensitivity particularly in the long wavelengthregion, the method described in Patent Document 1 has been developed.According to this method, however, a plurality of photoelectricconversion outputs for one pixel are difficult to obtain; therefore,application of this method to a wide variety of purposes is difficult.In addition, the method described in Patent Document 1 performsion-implantation (ion implantation) from both surfaces of thesemiconductor substrate, and thus requires special facilities forexecuting laser annealing or other processes capable of completingthermal processing in a short period. Moreover, the possibility of colormixture still exists.

In case of a front surface irradiation type image sensor, the thicknessof the silicon substrate may be large. However, for forming a potentialat a position sufficiently deep for efficient photoelectric conversionof near infrared light, ultra-high energy ion implantation is required.

[Imaging Element of Present Technology]

Accordingly, discussed in the present disclosure is an imaging elementcapable of achieving photo-electric conversion of components in aplurality of different wavelength regions of incident light for onepixel, such as visible light and near infrared light discussed above.

FIG. 2 illustrates a configuration example of a CMOS image sensor towhich the present technology is applied. A CMOS image sensor 100illustrated in FIG. 2 is an image sensor equipped with CMOS similarly tothe CMOS image sensor 10 illustrated in FIG. 1.

FIG. 2 shows a schematic structure of the CMOS image sensor 100 in thevertical direction (lamination direction) (schematic view of crosssection). As illustrated in FIG. 2, light enters the CMOS image sensor100 in the direction substantially from above to below in the figure.The CMOS image sensor 100 has multilayer structure in the travelingdirection of the incident light. In other words, light having enteredthe CMOS image sensor 100 passes through the respective layers whiletraveling.

FIG. 2 shows four pixels corresponding to an effective pixel area of theCMOS image sensor 100. More specifically, photo diodes 115-1 to 115-4are formed in a semiconductor substrate 114 as components constitutingthe four pixels. A condensing lens 111-1 and a color filter 112-1 areformed as components constituting the pixel for the photo diode 115-1. Acondensing lens 111-2 and a color filter 112-2 are formed as componentsconstituting the pixel for the photo diode 115-2. A condensing lens111-3 and a color filter 112-3 are formed as components constituting thepixel for the photo diode 115-3. A condensing lens 111-4 and a colorfilter 112-4 are formed as components constituting the pixel for thephoto diode 115-4.

The respective photo diodes are collectively referred to as photo diodes115 when distinction between the respective photo diodes is not needed.The respective condensing lenses are collectively referred to ascondensing lenses 111 when distinction between the respective condensinglenses is not needed. The respective color filters are collectivelyreferred to as color filters 112 when distinction between the respectivecolor filters is not needed.

Layers above a passivation film 119 of the CMOS image sensor 100 in thefigure have a configuration similar to the corresponding configurationof the CMOS image sensor 10 illustrated in FIG. 1. More specifically,layers formed on the upper side with respect to the passivation film 119in the figure are the condensing lens 111, the color filter 112, aninsulation film 113, the semiconductor substrate 114 (containing photodiodes 115), a wiring layer 116 (containing wires 117 and the wireinterlayer film 118), and the passivation film 119 in this order fromabove in the figure.

The condensing lenses 111 condense light having entered an imagingsurface onto the corresponding photo diodes 115 to increase quantumefficiency of the photo diodes 115.

The color filters 112 transmit the incident light having entered via thecorresponding condensing lenses 111 to supply components inpredetermined wavelength (color) regions of the incident light to thecorresponding photo diodes 115. The wavelength (color) regionstransmitted by the respective color filters 112 are arbitrarilydetermined, such as visible light, infrared light, and ultravioletlight. In addition, the color filters 112 may be filters eachtransmitting the same wavelength (color) region, or a plurality of typesof filters transmitting different wavelength (color) regions such asRGB, and visible light and infrared light.

When the color filters 112 are constituted by the plural types offilters, the filters for the respective wavelength (color) regions maybe arranged in a predetermined order such as Bayer array. For example,the color filter 112-1 and the color filter 112-3 in FIG. 2 may befilters transmitting red (R), while the color filter 112-2 and the colorfilter 112-4 may be filters transmitting green (G (Gr)). Alternatively,the color filter 112-1 and the color filter 112-3 in FIG. 2 may befilters transmitting green (G (Gb)), for example, while the color filter112-2 and the color filter 112-4 may be filters transmitting blue (B).

The photo diodes 115 formed in the semiconductor substrate 114 chieflyachieve efficient photoelectric conversion of components in the visiblelight wavelength region similarly to the example shown in FIG. 1. Morespecifically, each of the photo diodes 115 has potential distributionfor storing photoelectrically converted electrons at a depth appropriatefor components in the visible light wavelength region contained in theincident light. For example, visible light 141 is transmitted throughthe condensing lens 111-2, the color filter 112-2, and the insulationfilm 113, and is photoelectrically converted by the photo diode 115-2with high efficiency.

The film thickness of the semiconductor substrate 114 is arbitrarilydetermined. For example, the film thickness of the semiconductorsubstrate 114 may be in a range from about 2 μm to about 3 μm to avoidgeneration of color mixture.

The wires 117 of the wiring layer 116 are made of aluminum (AL) or same(Cu), for example. While only a piece is indicated as the wire 117 inFIG. 2, all squares in gray contained in the wiring layer 116 in FIG. 2are the wires 117. While the wires 117 have four-layer structure in thewiring layer 116 in the example in FIG. 2, the number of layers of thewires may be arbitrarily determined.

Unlike the CMOS image sensor 10 illustrated in FIG. 1, the CMOS imagesensor 100 further includes a wiring layer 120, a semiconductorsubstrate 123, and a support substrate 125 below the passivation film119 in the figure as illustrated in FIG. 2.

The wiring layer 120 is basically identical to the wiring layer 116. Thewiring layer 120 includes wires 121 and a wire interlayer film 122.While only a piece is indicated as the wire 121 in FIG. 2, all squaresin gray contained in the wiring layer 120 in FIG. 2 are the wires 121.While the wires 121 have two-layer structure in the wiring layer 120according to the example in FIG. 2, the number of layers of the wiresmay be arbitrarily determined.

A pad 132 is provided in an area of the wiring layer 116 out of theeffective pixel area of the CMOS image sensor 100. The pad 132corresponds to an external electrode of a circuit for the wiring layer116. A pad 133 is provided in an area of the wiring layer 120 out of theeffective pixel area of the CMOS image sensor 10. The pad 133corresponds to an external electrode of a circuit for the wiring layer120. The pad 132 and the pad 133 are connected with a TSV(Through-Silicon Via) 131 (so-called through via). In other words, thecircuit for the wiring layer 116 and the circuit for the wiring layer120 are connected. The number of TSV 131 may be arbitrarily determined.Though not shown in the figure, pads (external electrodes) connectedwith circuits outside the CMOS image sensor 100 are provided in thewiring layer 116 and the wiring layer 120 in an area out of theeffective pixel area of the CMOS image sensor 100 other than electrodesconnected with each other via the TSV 131 such as the pad 132 and thepad 133.

The semiconductor substrate 123 is a layer basically identical to thesemiconductor substrate 114. A photo diode 124-1 is formed in thesemiconductor substrate 123 as a component constituting the pixel forthe photo diode 115-1. A photo diode 124-2 is formed in thesemiconductor substrate 123 as a component constituting the pixel forthe photo diode 115-2. A photo diode 124-3 is formed in thesemiconductor substrate 123 as a component constituting the pixel forthe photo diode 115-3. A photo diode 124-4 is formed in thesemiconductor substrate 123 as a component constituting the pixel forthe photo diode 115-4. The photo diodes 124-1 to 124-4 are collectivelyreferred to as photo diodes 124 when distinction between the respectivephoto diodes is not needed.

Incident light having passed through the photo diodes 115 (incidentlight not photoelectrically converted by the photo diodes 115) entersthe semiconductor substrate 123 (photo diodes 124) via the wiring layer116, the passivation film 119, and the wiring layer 120. The wires 117and the wires 121 in the wiring layer 116 and the wiring layer 120 aredisposed in such positions as to secure the optical path of the incidentlight. For example, the wires 117 and the wires 121 may be disposed onlyin areas below hatched portions of the semiconductor substrate 114(portions not containing the photo diodes 115), and only in areas abovehatched portions of the semiconductor substrate 123 (portions notcontaining the photo diodes 124) as illustrated in FIG. 2. In otherwords, this positioning allows the use of the wires 117 and the wires121 as light shielding walls surrounding the optical path. In this case,the incident light is easily reflected by the wires 117 and the wires121; therefore, leakage of the incident light from the optical path tothe outside is prevented. Accordingly, the efficiency of photoelectricconversion increases, and generation of color mixture decreases.

The photo diodes 124 are disposed at positions (depths) appropriate forphotoelectric conversion of components in the near infrared wavelengthregion, and achieve efficient photoelectric conversion of components inthe near infrared wavelength region contained in the incident lighthaving entered the photo diodes 124 without photoelectric conversion bythe photo diodes 115. For example, near infrared light 142 istransmitted through the condensing lens 111-4, the color filter 112-4,the insulation film 113, the photo diode 115-4, the wiring layer 116,the passivation film 119, and the wiring layer 120, andphotoelectrically converted by the photo diode 124-4 with highefficiency.

As discussed above, the CMOS image sensor 100 has multilayer structurein the traveling direction of incident light, and includes double layers(semiconductor substrate 114 and semiconductor substrate 123) of photodiodes (photoelectric conversion elements) between which wiring layers(wiring layer 116 and wiring layer 120) are sandwiched.

This configuration of the CMOS image sensor 100 allows efficientphotoelectric conversion of components in both the visible light andnear infrared light wavelength regions (i.e., components in pluraldifferent wavelength regions) for one pixel by using the photo diodes115 and the photo diodes 124. In other words, the depth of the photodiodes 124 is easily determined by adjustment of the thicknesses of thewiring layers (wiring layer 116 and wiring layer 120) sandwiched betweenthe photo diodes 115 and the photo diodes 124 which are easilyadjustable in thickness. Accordingly, the efficiency of photoelectricconversion more easily improves in a plurality of arbitrary wavelengthregions.

A part or all of the pixels included in the CMOS image sensor 100 areconstructed as above. Accordingly, the CMOS image sensor 100 forms(high-quality) visible light images and (high-quality) near infraredlight images without decreasing the number of pixels and the pixel size,i.e., while preventing deterioration of image quality. The CMOS imagesensor 100 forms visible light images having at least image qualityequivalent to the image quality of the CMOS image sensor 10 illustratedin FIG. 1, and further forms near infrared light images.

The CMOS image sensor 100 forms both visible light images and nearinfrared light images by using the double-layered photo diodes (photodiodes 115 and photo diodes 124). Accordingly, the CMOS image sensor 100is allowed to simultaneously form visible light images and near infraredlight images (to form both images at the same timing). There is a casewhere infrared light images and visible light images formed at the sametiming are desired such as a process executed using both the images. Forexample, there is a process in which an image correcting method isdetermined using infrared light images, and visible light images iscorrected using the determined image correcting method. Needless to say,there is also a case where both the images formed at different timingare desired. The CMOS image sensor 100 is allowed to form visible lightimages and near infrared light images at different timing.

Moreover, the CMOS image sensor 100 forms high-quality infrared lightimages by synthesizing images obtained by the photo diodes 115 andimages obtained by the photo diodes 124. Accordingly, such a nearinfrared sensor is realizable which has an extended effective opticalpath length.

At least a part of the wires 117 and the wires 121 may correspond towires of circuits for reading charges from at least either the photodiodes 115 or the photo diodes 124. For example, at least a part of thewires 117 of the wiring layer 116 may correspond to wires of circuitsfor reading charges from the photo diodes 115, while at least a part ofthe wires 121 of the wiring layer 120 may correspond to wires ofcircuits for reading charges from the photo diodes 124. In this case,the respective circuits may be independent from each other.

According to this structure, the condensing lenses 111 through thepassivation film 119 in FIG. 2 form a rear surface irradiation type CMOSimage sensor, while the wiring layer 120 through the support substrate125 form a front surface irradiation type CMOS image sensor. The rearsurface irradiation type CMOS image sensor and the front surfaceirradiation type CMOS image sensor are independent from each other. Inthis case, the CMOS image sensor 100 includes the two independent CMOSimage sensors overlapping with each other and connecting with eachother.

The CMOS image sensor 100 thus constructed forms high-quality visiblelight images by photoelectric conversion of components in the visiblelight wavelength region of incident light using the rear surfaceirradiation type CMOS image sensor. On the other hand, the CMOS imagesensor 100 forms high-quality near infrared light images byphotoelectric conversion of components in the near infrared lightwavelength region of incident light using the front surface irradiationtype CMOS image sensor.

Moreover, the CMOS image sensors overlapped as components of the CMOSimage sensor 100 may operate independently from each other. Accordingly,the CMOS image sensor 100 is allowed to simultaneously form visiblelight images and near infrared light images (to form images at the sametiming), and form visible light images and near infrared light images atdifferent timing with ease, for example. In addition, switching controlis easily achievable.

For example, for forming visible light images and near infrared lightimages at the same time, charges accumulated by photoelectric conversionof incident light using the photo diodes 115 and charges accumulated byphotoelectric conversion of incident light using the photo diodes 124are output at the same timing. On the other hand, for forming visiblelight images and near infrared light images at different timing, forexample, charges accumulated in the photo diodes 115 and chargesaccumulated in the photo diodes 124 are output at different timing.

Accordingly, the CMOS image sensor 100 provides a wider variety ofphotoelectric conversion outputs more easily.

2. Second Embodiment Manufacturing Device

As discussed above, the CMOS image sensor 100 illustrated in FIG. 2 maybe so configured that the condensing lenses 111 through the passivationfilm 119 constitute the rear surface irradiation type CMOS image sensor,and that the wiring layer 120 through the support substrate 125constitute the front surface irradiation type CMOS image sensor.

Assuming that the respective CMOS image sensors are independent fromeach other, the CMOS image sensor 100 may be manufactured by separatelyproducing the rear surface irradiation type CMOS image sensor and thefront surface irradiation type CMOS image sensor, overlapping the frontsurface irradiation type CMOS image sensor on the front surface side ofthe produced rear surface irradiation type CMOS image sensor, andconnecting both the CMOS image sensors via the TSV 131.

FIG. 3 is a block diagram illustrating an example of a chiefconfiguration of a manufacturing device to which the present technologyis applied. A manufacturing device 200 illustrated in FIG. 3 is a devicewhich manufactures the CMOS image sensor 100.

As illustrated in FIG. 3, the manufacturing device 200 includes acontrol unit 201, a rear surface irradiation type image sensormanufacturing unit 202, a front surface irradiation type image sensormanufacturing unit 203, and an assembling unit 204. The manufacturingdevice 200 further includes an input unit 211, an output unit 212, amemory unit 213, a communication unit 214, and a drive 215.

The control unit 201 includes a CPU (Central Processing Unit), a ROM(Read Only Memory), and a RAM (Random Access Memory), and others. Thecontrol unit 201 controls respective other units, and executes processesassociated with manufacture of the CMOS image sensor 100. For example,the CPU of the control unit 201 executes various types of processesunder programs stored in the ROM. Moreover, the CPU executes varioustypes of processes under programs loaded from the memory unit 213 to theRAM. The RAM also stores data required for execution of the varioustypes of processes by the CPU as necessary, for example.

The control unit 201 connects to the input unit 211 constituted by akeyboard, a mouse, a touch panel and others. The control unit 201further connects to the output unit 212 constituted by a display such asa CRT (Cathode Ray Tube) display and an LCD (Liquid Crystal Display), aspeaker and others. The control unit 201 further connects to the memoryunit 213 constituted by an SSD (Solid State Drive) such as a flashmemory, and a hard disk. The control unit 201 further connects to thecommunication unit 214 constituted by interfaces of a wired LAN (LocalArea Network) and a wireless LAN, a modem and others. The communicationunit 214 executes communication processes via networks including theInternet.

The control unit 201 further connects to the drive 215 as necessary sothat a removable medium 221 such as a magnetic disk, an optical disk, amagneto-optical disk, a semiconductor memory or the like is attachableto the drive 215. Computer programs read from the removable medium 221via the drive 215 are installed in the memory unit 213 as necessary.

The rear surface irradiation type image sensor manufacturing unit 202manufactures a rear irradiation type CMOS image sensor under the controlby the control unit 201. In other words, the rear surface irradiationtype image sensor manufacturing unit 202 produces the condensing lenses111 to the passivation film 119 of the CMOS image sensor 100. Thismanufacturing method may be an arbitrary method. For example, the rearsurface irradiation type image sensor manufacturing unit 202manufactures the rear surface irradiation type CMOS image sensor by amethod similar to a conventional method.

The front surface irradiation type image sensor manufacturing unit 203manufactures a front irradiation type CMOS image sensor under thecontrol by the control unit 201. In other words, the front surfaceirradiation type image sensor manufacturing unit 203 produces the wiringlayer 120 to the support substrate 125 of the CMOS image sensor 100.This manufacturing method may be an arbitrary method. For example, thefront surface irradiation type image sensor manufacturing unit 203manufactures the front surface irradiation type CMOS image sensor by amethod similar to a conventional method.

The assembling unit 204 assembles the CMOS image sensor 100 under thecontrol by the control unit 201. In this case, the assembling unit 204connects the rear surface irradiation type CMOS image sensormanufactured by the rear surface irradiation type image sensormanufacturing unit 202 and the front surface irradiation type CMOS imagesensor manufactured by the front surface irradiation type image sensormanufacturing unit 203. More specifically, the assembling unit 204overlaps the front surface irradiation type CMOS image sensor on thefront surface side of the rear surface irradiation type CMOS imagesensor, and connects the pads of both the CMOS image sensors via the TSV131.

[Flow of Manufacturing Method]

A flow example of a manufacturing process is now described withreference to a flowchart shown in FIG. 4.

When manufacturing the CMOS image sensor 100 by using the manufacturingdevice 200, the control unit 201 executes the manufacturing process.

After the start of the manufacturing process, the control unit 201allows the rear surface irradiation type image sensor manufacturing unit202 to manufacture a rear surface irradiation type CMOS image sensor instep S101.

In step S102, the control unit 201 allows the front surface irradiationtype image sensor manufacturing unit 203 to manufacture a front surfaceirradiation type CMOS image sensor.

In step S103, the control unit 201 allows the assembling unit 204 toassemble the CMOS image sensor 100. More specifically, the assemblingunit 204 overlaps the front surface irradiation type CMOS image sensormanufactured by the process in step S102 on the front surface side ofthe rear surface irradiation type CMOS image sensor manufacture by theprocess in step S101 under the control by the control unit 201. Then,the assembling unit 204 connects the pads of these CMOS image sensors bya through via (TSV) under the control by the control unit 201.

After completion of the process in step S103, the control unit 201 endsthe manufacturing process.

According to the foregoing manufacturing method, the manufacturingdevice 200 more easily manufactures the CMOS image sensor 100 withoutthe necessity of ultra-high energy ion implantation, or specialprocesses or facilities required by laser annealing or the like. Inother words, such an imaging element is more easily realizable which canmore easily provide a wider variety of photoelectric conversion outputs.

3. Third Embodiment Imaging Element

The CMOS image sensor 100 may have arbitrary configurations as long as alarge amount of light having passed through the photo diodes 115 travelsthrough the wiring layer 116 and the wiring layer 120 (between therespective wires of the wiring layers 116 and 120) and reach the photodiodes 124. In other words, the positions of the respective wires 117 ofthe wiring layer 116 and the positions of the respective wires 121 ofthe wiring layer 120 are arbitrarily determined as long as the opticalpath of incident light is secured from the diodes 115 to the photodiodes 124. For example, the wires 117 and the wires 121 may bepositioned below the photo diodes 115 or above the photo diodes 124.

In addition, waveguides may be formed in the wiring layer 116, forexample. FIG. 5 is a figure illustrating a configuration example of theCMOS image sensor 100 thus constructed. According to the exampleillustrated in FIG. 5, a waveguide 251-1 is formed in the wiring layer116 of the CMOS image sensor 100 in an area substantially below thephoto diode 115-1. A waveguide 251-2 is further formed in the wiringlayer 116 in an area substantially below the photo diode 115-2. Awaveguide 251-3 is further formed in the wiring layer 116 in an areasubstantially below the photo diode 115-3. A waveguide 251-4 is furtherformed in the wiring layer 116 in an area substantially below the photodiode 115-4. The waveguides 251-1 to 251-4 are collectively referred toas waveguides 251 when no distinction between the respective waveguides251-1 to 251-4 is needed.

The waveguides 251 are constituted by predetermined waveguide materialmade of material having a larger refractive index than that of thesurroundings, for example. Other configurations are similar to thecorresponding configurations in FIG. 2.

The waveguides 251 are formed during production of the rear surfaceirradiation type CMOS image sensor. For example, holes are formed in thewiring layer 116 in areas substantially below the photo diodes 115(between the wires 117) in the direction from below to above in thefigure. Then, the passivation film 119 is formed on the front surfaceside (lower surface in the figure) of the rear surface irradiation typeCMOS image sensor containing the holes. Thereafter, the waveguides 251are formed in the respective holes of the wiring layer 116.

As illustrated in FIG. 5, incident light having passed through the photodiodes 115 reach the photo diodes 124 via the waveguides 251. In thiscase, the CMOS image sensor 100 more efficiently supplies the nearinfrared light 142 corresponding to components in the near infraredlight wavelength region contained in the incident light to the photodiodes 124 by waveguide effect of the waveguides 251. Accordingly, thesensitivity of the photo diodes 124 improves.

The waveguides may be formed in the wiring layer 120. Alternatively, thewaveguides may be formed in both the wiring layer 116 and the wiringlayer 120. In either of the cases, the sensitivity of the photo diodes124 improves as discussed above. The material of the waveguides may bearbitrarily determined.

The CMOS image sensor 100 described in this embodiment may bemanufactured by a method similar to the method discussed in the secondembodiment. More specifically, the control unit 201 may allow the rearsurface irradiation type image sensor manufacturing unit 202 to form theforegoing waveguides in the wiring layer 116 at the time of manufactureof the rear surface irradiation type CMOS image sensor (step S101). Thewaveguides may be formed by a method similar to a conventional method.

When forming the waveguides in the wiring layer 120, the control unit201 may allow the front surface irradiation type image sensormanufacturing unit 203 to form the foregoing waveguides in the wiringlayer 120 at the time of manufacture of the front surface irradiationtype CMOS image sensor (step S102). In this case, the waveguides mayalso be formed by a method similar to a conventional method.

When forming the waveguides in both the wiring layer 116 and the wiringlayer 120, the control unit 201 allows both the rear surface irradiationtype image sensor manufacturing unit 202 and the front surfaceirradiation type image sensor manufacturing unit 203 to form thewaveguides in the respective wiring layers.

Accordingly, the manufacturing device 200 more easily manufactures theCMOS image sensor 100 in this embodiment similarly to the aboveembodiments.

4. Fourth Embodiment Imaging Element

The positions of the components for the respective pixels are notlimited to the foregoing examples.

Position correction (pupil correction) may be executed in accordancewith incident angles of incident light, for example.

In general, incident light entering an imaging element is affected by alens or the like. Incident light enters pixels in the vicinity of thecenter substantially at right angles, and enters pixels in theperipheral area at a predetermined angle (incident angle θ) to thecenter direction.

In case of the CMOS image sensor 100 illustrated in FIGS. 2 and 5, theoptical path of incident light is formed in the vertical direction inthe figures. This optical path is optimized for the incident lightentering substantially at right angles, but is not necessarily optimizedfor light entering at a predetermined angle. In this case, the lightcondensing rate of the photo diodes 115 and the photo diodes 124 maylower.

Accordingly, the positions of the respective components for therespective pixels may be corrected (disposed at appropriate positions)in accordance with the incident angle θ of the incident light asillustrated in FIG. 6.

FIG. 6 is a figure schematically illustrating the condition of the CMOSimage sensor where the components for the respective pixels arepositioned in consideration of the incident angle θ of incident light asviewed from the light entrance side.

As illustrated in FIG. 6, lenses 320 for respective pixels 310 of theCMOS image sensor 100, corresponding to microlenses for the respectivepixels, are shifted toward the center from sensor light receiving units310A in accordance with the incident angle θ of the incident light.

FIG. 7 illustrates cross sections of the CMOS image sensor 100 in thiscase as viewed similarly to FIGS. 2 and 5. As illustrated in FIG. 7, thecondensing lenses 111 and the color filters 112 are shifted toward thecenter from the photo diodes 115 in accordance with the incident angleθ. Practically, the condensing lenses 111 and the color filters 112 areshifted toward the center in a two-dimensional array as illustrated inFIG. 6.

This arrangement positions the optical path from the condensing lenses111 to the photo diodes 115 with inclination to the vertical directionat an angle corresponding to the incident angle θ. In this case, anappropriate optical path is established for the incident light;therefore, lowering of the light condensing rate of the photo diodes 115decreases.

The respective layers of the wires 117 may also be disposed withinclination in accordance with the incident angle θ of near infraredlight as in the example illustrated in FIG. 7. More specifically, thewires 117 may be disposed outside the photo diodes 115 (toward the sideopposite to the center) in accordance with the incident angle θ.

Moreover, the respective layers of the wires 121 may also be disposedwith inclination in accordance with the incident angle θ of nearinfrared light as in the example illustrated in FIG. 7. Morespecifically, the wires 121 may be disposed further outside the wires117 (toward the side opposite to the center) in accordance with theincident angle θ.

Furthermore, the photo diodes 124 may also be disposed further outsidethe wires 121 in accordance with the incident angle θ of near infraredlight as in the example illustrated in FIG. 7.

This arrangement positions the optical path from the photo diodes 115 tothe photo diodes 124 with inclination to the vertical direction at anangle corresponding to the incident angle θ. In this case, anappropriate optical path is established for the incident light;therefore, lowering of the light condensing rate of the photo diodes 124decreases.

The CMOS image sensor 100 described in this embodiment may bemanufactured by a method similar to the method discussed in the secondembodiment. More specifically, the positions of the respective layersare so determined as to allow the foregoing pupil correction at the timeof manufacture of the respective CMOS image sensors by the rear surfaceirradiation type image sensor manufacturing unit 202 and the frontsurface irradiation type image sensor manufacturing unit 203 under thecontrol by the control unit 201 (step S101 and step S102).

Accordingly, the manufacturing device 200 more easily manufactures theCMOS image sensor 100 in this embodiment similarly to the aboveembodiments.

5. Fifth Embodiment Imaging Element

The sizes, shapes, and intervals of the photo diodes may be arbitrarilydetermined. For example, at least one of these factors may be differentbetween the photo diodes 115 and the photo diodes 124 as illustrated inFIG. 8.

According to the example illustrated in FIG. 8, there are provided inthe semiconductor substrate 123 photo diodes 351-1 and 351-2 each havinga size equivalent to two pieces of the photo diodes 115. Morespecifically, the photo diode 351-1 is provided in the semiconductorsubstrate 1 below the photo diodes 115-1 and 115-2, and corresponds tothe photo diodes 115-1 and 115-2. Accordingly, the photo diode 351-1photoelectrically converts components in the near infrared lightwavelength region of incident light having passed through the photodiode 115-1 or the photo diode 115-2.

On the other hand, the photo diode 351-2 is provided in thesemiconductor substrate 1 below the photo diodes 115-3 and 115-4, andcorresponds to the photo diodes 115-3 and 115-4. Accordingly, the photodiode 351-2 photoelectrically converts components in the near infraredlight wavelength region of incident light having passed through thephoto diode 115-3 or the photo diode 115-4. The photo diodes 351-1 and351-2 are collectively referred to as photo diodes 351 when nodistinction between the photo diodes 351-1 and 351-2 is needed.

In this case, the arrangement intervals of the wires 117 in the wiringlayer 116 may be different from the arrangement intervals of the wires121 in the wiring layer 120. According to the example in FIG. 8, thewires 117 are formed in the semiconductor substrate 114 in areas out ofthe areas below the photo diodes 115 in accordance with the arrangementintervals of the photo diodes 115. On the other hand, the wires 121 areformed in the semiconductor substrate 123 in areas out of the areasabove the photo diodes 351 in accordance with the arrangement intervalsof the photo diodes 351.

The positions of the wires 117 and 121 are not limited to the positionsof the example shown FIG. 8, but may be arbitrarily determined. Forexample, the positions of the wires 117 may be disposed in areas out ofthe areas above the photo diodes 351 of the semiconductor substrate 123in alignment with the wires 121. Similarly, the positions of the wires121 may be disposed in areas out of the areas above the photo diodes 115of the semiconductor substrate 114 in alignment with the wires 117.

This arrangement allows the CMOS image sensor 100 to individually setthe resolution of visible light images and the resolution of nearinfrared light images. For example, the CMOS image sensor 100 formsvisible light image and near infrared light images having differentresolutions.

According to the example illustrated in FIG. 8, the sizes of the photodiodes in the horizontal direction are different for each layer.However, the different factor of the photo diodes for each layer may bearbitrarily determined as long as at least one of the factors of sizes,shapes, and intervals of the photo diodes is different for each layer.

The CMOS image sensor 100 described in this embodiment may bemanufactured by a method similar to the method discussed in the secondembodiment. More specifically, the rear surface irradiation type imagesensor manufacturing unit 202 and the front surface irradiation typeimage sensor manufacturing unit 203 manufacture the CMOS image sensorsindependently from each other. In this case, the sizes, shapes, andintervals of the photo diodes are allowed to be determined independentlyfrom each other.

Accordingly, the manufacturing device 200 more easily manufactures theCMOS image sensor 100 in this embodiment similarly to the aboveembodiments.

6. Sixth Embodiment Imaging Element

According to the embodiments discussed above, both visible light imagesand near infrared light images are formed. However, the thicknesses ofthe respective photo diodes may be arbitrarily determined. Morespecifically, the wavelength regions photoelectrically converted by therespective photo diodes are arbitrarily determined, and the CMOS imagesensor 100 forms images in arbitrary wavelength regions by determiningthe depth of potential distribution for each photo diode in accordancewith the penetration length of incident light for silicon.

For example, the CMOS image sensor 100 may be configured to form twotypes of visible light images in different wavelength regions asillustrated in an example in FIG. 9. In case of the example illustratedin FIG. 9, a semiconductor substrate 360 is provided in place of thesemiconductor substrate 114 illustrated in FIG. 2. Photo diodes 361-1 to361-4 are formed in the semiconductor substrate 360. More specifically,the photo diodes 361-1 to 361-4 correspond to the photo diodes 115-1 to115-4, respectively. The photo diodes 361-1 to 361-4 are collectivelyreferred to as photo diodes 361 when no distinction between the photodiodes 361-1 to 361-4 is needed. Other configurations are similar to thecorresponding configurations in FIG. 2.

The thickness (such as 1 μm) of the semiconductor substrate 360 issmaller than the thickness of the semiconductor substrate 114illustrated in FIG. 2. This configuration allows the photo diodes 361 tophotoelectrically convert components in a short wavelength region ofvisible light (visible light 381) contained in incident light. Inaddition, reduction of the thickness of the photo diodes 361 decreasesthe depth of the photo diodes 124. Accordingly, this configurationallows the photo diodes 124 to photoelectrically convert components in along wavelength region of visible light (visible light 382) contained inincident light instead of near infrared light. For example, thisconfiguration allows the CMOS image sensor 100 to form images usingphoto diodes contained in different layers for each color.

Accordingly, the CMOS image sensor 100 includes photo diodes in aplurality of layers, and executes photoelectric conversion individuallyfor each layer. In this case, the components in wavelength regions to bephotoelectrically converted by the photo diodes may be determined foreach layer of the diodes. As discussed above, the thicknesses of therespective photo diodes may be arbitrarily determined; therefore thethicknesses of the photo diodes may be determined independently for eachlayer. For example, the thicknesses of the photo diodes may be differentfor each layer, or the thicknesses of all the photo diodes may beequalized. In other words, the components in respective wavelengthregions to be photoelectrically converted by the respective photo diodesare determined more easily and more freely.

As discussed above, the CMOS image sensor 100 controls not onlycomponents in wavelength regions to be photoelectrically converted bythe photo diodes 361, but also components in wavelength regions to bephotoelectrically converted by the photo diodes 124 in accordance withthe thicknesses of the photo diodes 361.

The CMOS image sensor 100 described in this embodiment may bemanufactured by a method similar to the method discussed in the secondembodiment. More specifically, the rear surface irradiation type imagesensor manufacturing unit 202 and the front surface irradiation typeimage sensor manufacturing unit 203 manufacture the CMOS image sensorsindependently from each other. In this case, the thicknesses of thelayers of the photo diodes are allowed to be determined independentlyfrom each other.

Accordingly, the manufacturing device 200 more easily manufactures theCMOS image sensor 100 in this embodiment similarly to the aboveembodiments.

7. Seventh Embodiment Imaging Element

According to the embodiments described above, the front surfaceirradiation type CMOS image sensor is overlapped on the front surfaceside of the rear surface irradiation type CMOS image sensor. However,the rear surface irradiation type CMOS image sensor may be overlapped inplace of the front surface irradiation type CMOS image sensor asillustrated in FIG. 10, for example.

A CMOS image sensor 400 illustrated in FIG. 10 includes the condensinglenses 111 to the passivation film 119 similar to the correspondingcomponents of the foregoing CMOS image sensor 100. The CMOS image sensor400 includes a semiconductor substrate 411 and a wiring layer 413 inplace of the wiring layer 120 to the support substrate 125.

The semiconductor substrate 411 includes photo diodes 412-1 to 412-4 incorrespondence with the respective pixels of the photo diodes 115-1 to115-4. The photo diodes 412-1 to 412-4 are collectively referred to asphoto diodes 412 when no distinction between the photo diodes 412-1 to412-4 is needed.

The photo diodes 412 photoelectrically convert components in awavelength region different from the wavelength region of the photodiodes 115 similarly to the photo diodes 124. More specifically, thephoto diodes 412 photoelectrically convert a longer wavelength regionthan the wavelength region of the photo diodes 115. For example, thephoto diodes 115 photoelectrically convert components in a visible lightwavelength region, while the photo diodes 412 photoelectrically convertscomponents in a near infrared light wavelength region. Alternatively,the photo diodes 115 photoelectrically convert components in a visiblelight short wavelength region, while the photo diodes 412photoelectrically convert components in a visible light long wavelengthregion, for example.

In case of the CMOS image sensor 400, the wiring layer 413 is formedbelow the semiconductor substrate 411 as viewed in the figure. Morespecifically, the CMOS image sensor 400 includes a rear surfaceirradiation type CMOS image sensor on the front surface side of the rearsurface irradiation type CMOS image sensor.

The wiring layer 413 is basically identical to the wiring layer 116 andthe wiring layer 120, and includes an arbitrary layer number of wires414 and a wire interlayer film 415. The wiring layer 413 is disposedbelow the photo diodes 412; therefore, formation of an optical path isnot necessary for the wiring layer 413. In this case, the wires 414 maybe disposed at arbitrary positions. Accordingly, easier layout isallowed for the wires 414.

Similarly to the wiring layer 116 and the wiring layer 120, a pad 423corresponding to an external terminal is provided in the wiring layer413 in an area out of the effective pixel area. The pad 423 is connectedwith the pad 132 of the wiring layer 116 via a TSV 421.

Accordingly, the CMOS image sensor 400 more easily provides a widervariety of photoelectric conversion outputs similarly to the CMOS imagesensor 100.

In case of the CMOS image sensor 400, incident light reaches the photodiodes at the deeper positions (photo diodes 412) without passingthrough the wiring layer 413. Accordingly, the CMOS image sensor 400further increases the sensitivity of the photo diodes 412 in comparisonwith the structure which overlaps a front surface irradiation type CMOSimage sensor as the CMOS image sensor 100.

The CMOS image sensor 100 described in this embodiment may bemanufactured by a method basically similar to the method discussed inthe second embodiment. However, the control unit 201 controls the rearsurface irradiation type image sensor manufacturing unit 202 to allowmanufacture of a rear surface irradiation type CMOS image sensor in theprocess in step S102 in place of controlling the front surfaceirradiation type image sensor manufacturing unit 203. This rear surfaceirradiation type CMOS image sensor may be produced in a manner similarto a conventional method similarly to step S101. Other processes may beexecuted in a manner similar to the corresponding processes discussed inthe second embodiment.

Accordingly, the manufacturing device 200 more easily manufactures theCMOS image sensor 100 in this embodiment similarly to the aboveembodiments.

The manufacturing methods of the CMOS image sensor described in therespective embodiments are not greatly different from each other asobvious from above. Accordingly, the manufacturing device 200 can easilyswitch the manufacturing methods without the necessity of preparation ofa new special device or addition of a new special step as long as themethods to be selected are included in the foregoing respectivemanufacturing methods. Accordingly, the manufacturing device 200 moreeasily manufactures a wider variety of CMOS image sensors.

According to the above description, the present technology has beenapplied to a CMOS image sensor. However, the present technology isapplicable to any types of imaging elements using photoelectricconversion elements such as photo diodes as well as the CMOS imagesensor. For example, the present technology is applicable to a CCD(Charge Coupled Device) image sensor.

According to the above description, the two photo diode layers betweenwhich the wiring layer is sandwiched are provided. However, the numberof the photo diode layers may be three or more. In this case, the threeor more layers of photo diodes may be provided with a wiring layersandwiched between each of the layers. In other words, three or morelayers of rear surface irradiation type or surface irradiation type CMOSimage sensors may be overlapped with each other, and respective pads maybe connected with each other via through vias.

The three or more layers of photo diodes thus provided similarly formimages in different wavelength regions. More specifically, the CMOSimage sensor thus constructed is allowed to form three types of imagesin different wavelength regions. Accordingly, the CMOS image sensor moreeasily provides a wider variety of photoelectric conversion outputs.

The charge accumulation time of the photo diodes in the respectivelayers may be determined independently for each layer. In this case, thephoto diodes in the respective layers are easily driven in accordancewith different charge accumulation time. Accordingly, the chargeaccumulation time for one of the photo diode layers may be set longerthan each charge accumulation time of the other layers. The CMOS imagesensor thus constructed forms images in a wider dynamic range than therange of images formed by a single-layer photo diode by synthesizing aplurality of images formed with different charge accumulation times.

As described above, the CMOS image sensor 100 photoelectrically convertscomponents in different wavelength regions of incident light by therespective photo diode layers.

8. Eighth Embodiment Imaging Device

FIG. 11 is a figure illustrating a configuration example of an imagingdevice to which the present technology is applied. An imaging device 600illustrated in FIG. 11 is a device which images a subject and outputs animage of the subject as an electric signal.

As illustrated in FIG. 11, the imaging device 600 includes a lens unit611, a CMOS sensor 612, an A/D converting unit 613, an A/D converter613, an operating unit 614, a control unit 615, an image processing unit616, a display unit 617, a codec processing unit 618, and a recordingunit 619.

The lens unit 611 adjusts a focus positioned in the course of a subject,condenses light coming from a position in focus, and supplies the lightto the CMOS sensor 612.

The CMOS sensor 612 is a solid imaging element having the foregoingstructure, and contains color mixture detecting pixels within aneffective pixel area.

The A/D converter 613 converts voltage signals supplied at predeterminedtiming from the CMOS sensor 612 for each pixel into digital imagesignals (hereinafter referred to as pixel signals depending onsituations), and sequentially supplies the converted signals to theimage processing unit 616.

The operating unit 614 is constituted by a jog dial (registeredtrademark), keys, buttons, a touch panel, or others, for example. Theoperating unit 614 receives operation input from a user, and suppliessignals corresponding to the operation input to the control unit 615.

The control unit 615 controls driving of the lens unit 611, the CMOSsensor 612, the A/D converter 613, the image processing unit 616, thedisplay unit 617, the codec processing unit 618, and the recording unit619 based on the signals corresponding to the operation input from theuser via the operating unit 614, and allows the respective units toexecute processes associated with imaging.

The image processing unit 616 executes various types of image processingsuch as the foregoing color mixture correction, black level correction,white balance adjustment, demosaic processing, matrix processing, gammacorrection, and YC conversion for the image signals supplied from theA/D converter 613. The image processing unit 616 supplies the imagesignals obtained after the image processing to the display unit 617 andthe codec processing unit 618.

The display unit 617 is constituted by a liquid display, for example,and displays an image of the subject based on the image signals suppliedfrom the image processing unit 616.

The codec processing unit 618 executes an encoding process in apredetermined system for the image signals received from the imageprocessing unit 616, and supplies image data obtained as a result of theencoding process to the recording unit 619.

The recording unit 619 records the image data supplied from the codecprocessing unit 618. The image data recorded in the recording unit 619is read by the image processing unit 616 as necessary to be supplied tothe display unit 617. As a result, a corresponding image is displayed.

The imaging device including the solid imaging sensor and the imageprocessing unit to which the present technology is applied is notlimited to the foregoing configurations, but may have otherconfigurations.

9. Ninth Embodiment Ordinary Image Sensor

According to an ordinary image sensor (such as image sensors disclosedin Japanese Patent Application Laid-Open Nos. 2010-232595, 2010-41034,and 2008-103368), the maximum depth of photo diodes to be formed insilicon (Si) substrate is limited to a certain depth. This depth isdetermined by limitation associated with implantation in a photo diodeforming process, and factors such as performance for transferringcharges after photoelectric conversion, and electric color mixture withadjacent pixels. The limited depth is approximately 3 μm in many cases.However, there is an increasing demand for infrared sensitivity inrecent years. Light absorbable by silicon (Si) is dependent onwavelengths; therefore, silicon only absorbs about half of light evenwhen the depth is 3 μm. In this case, it may be difficult tosufficiently increase sensitivity for infrared light.

For overcoming this problem, a method of overlapping two imaging sensorshas been proposed (for example, see Japanese Patent ApplicationLaid-Open No. 2008-227250). According to this method, however, adistance (such as spacer) is produced between imaging sensors when twoimaging sensors are only affixed to each other, and, thus, the distanceor an inserted object such as a spacer may produce sensitivity losses.For increasing sensitivity of photo diodes on both the upper surface andthe lower surface, it is preferable that the photo diodes on both theupper surface and the lower surface are disposed at the closest possiblepositions to an on-chip lens (OCL).

More specifically, a complex type solid imaging element described inJapanese Patent Application Laid-Open No. 2008-227250 is constituted bysolid imaging sensors already completed and joined to each other. Eachof the solid imaging sensors is extremely thin; therefore, a wafer whereeach of the solid imaging elements is provided is fragile. Accordingly,a dedicated special device is needed to join these imaging sensors whileavoiding breakage of the wafers. In this case, the manufacture becomesdifficult, and the cost may considerably increase. Moreover, it may bedifficult to obtain sufficient yields.

Therefore, junction by an ordinary method is preferable. In this case,however, each thickness of the wafers needs to be several hundred um orlarger to avoid breakage of the respective wafers at the time ofjunction. For this purpose, a support substrate needs to be provided foreach of the solid imaging elements to be joined. For example, in case ofthe example illustrated in FIG. 2, the support substrate is formed inthe configuration of the imaging element on the lower side in thefigure. However, no support substrate is formed in the configuration ofthe imaging element on the upper side.

According to the method described in Japanese Patent ApplicationLaid-Open No. 2008-227250, a spacer is provided for the configuration ofthe imaging element on the upper side in place of the support substrate.As obvious from this example, it is required in this method to insertthe support substrate or an alternative component between the imagingelements to be joined.

In this case, however, the distance between the photo diodes overlappedfor each pixel may become excessively long by the presence of thesupport substrate (or the alternative component). Under this condition,it may be difficult to achieve photoelectric conversion in a desiredwavelength region by the photo diodes located away from the lightentrance side (photo diodes 124 in case of the example in FIG. 2).Moreover, incident light is difficult to reach the corresponding photodiodes, and, thus, the sensitivity may lower without necessity.

Other possible example methods are disclosed in US 2009/0294813 A1 andUS 2009/0200589 A1, for example. The former document proposes a methodwhich joins a different substrate containing photo diodes to a frontsurface irradiation type image sensor. However, as discussed above, itis preferable that both photo diodes on the upper surface and photodiodes on the lower surface are disposed at closest possible positionsto an on-chip lens (OCL) for realizing high sensitivity of both thephoto diodes on the upper and lower surfaces. In other words, it ispreferable that the upper surface photo diodes are formed in a rearsurface irradiation type image sensor (Japanese Patent ApplicationLaid-Open No. 2008-103368, for example). Moreover, according to thisdocument, a temporary support substrate is joined to the frontirradiation (FIG. 3, for example), and removed in another step (FIG. 6,for example). In this case, a lot of complicated and ineffectual stepsare needed.

According to the technology described in the latter document, two lightreceiving units are provided on the same silicon (Si) substrate. In thiscase, individual reading from the upper surface and the lower surface isdifficult. In addition, the lower surface handles only IR light.Accordingly, many limitations are imposed.

The infrared light discussed above is also used for a distance measuringmethod called TOF (for example, see Japanese Patent ApplicationLaid-Open No. 2012-49547). In addition, there is a method for measuringa distance based on projection as described in US patent No. US2010/0118123 A1, for example. Concerning such technologies, furtherimprovement of distance measurement accuracy and improvement ofdurability for effects of external light have been demanded, forexample.

The use of wavelengths including near infrared wavelength is alsostarted in medical fields, for example, as wavelength regions expectedto improve analysis accuracy and the like. However, problems such as lowinfrared sensitivity are arising as discussed above. Moreover, onewavelength is analyzed for one pixel in a conventional method;therefore, irradiation of lights in a plurality of wavelength regions,or the use of a plurality of near infrared pixels is required in amethod for analyzing hemoglobin based on information about a pluralityof wavelengths (Japanese Patent No. 2932644, for example). In this case,miniaturization of imaging elements and imaging devices becomesdifficult.

For application to capsule endoscopes and the like in the future,further miniaturization and improvement in accuracy will be demanded. Inanalyzing optical characteristics of micro-molecules and DNA, themolecule size falls within one pixel. In this case, the number and thestructure of the molecules arranged for each pixel differ in case of theuse of plural pixels such as Bayer array, and, thus, accurate analysismay become difficult.

Furthermore, also considering lights other than infrared light, there isproposed a vertical spectrum structure for obtaining colors such as RGBby one pixel. For example, this method is proposed in Japanese PatentApplication Laid-Open No. 2011-29453. This method provides a pluralityof photo diodes within a single silicon (Si) substrate. Accordingly,this method requires individual reading gate electrodes for the photodiodes on the silicon (Si) surface side, and for the photo diodes on thesilicon (Si) deep side. In addition, this method requires etching ofsilicon (Si) up to a depth equivalent to the photo diodes and forming ofthe gate electrodes for reading from the photo diodes on the silicon(Si) deep side (for example, Japanese Patent Application Laid-Open No.2011-29453, FIG. 16). In this case, the photo diode area forphotoelectric conversion decreases by the area of the gate electrodes.This condition may adversely affects the number of saturated electronsand the sensitivity. Moreover, etching for excavating silicon at thetime of formation of the gate electrodes may damage the silicon (Si)substrate, and, thus, dark current, white spots and other problems maybe generated.

Furthermore, according to the vertical spectrum structure, control overplural wavelength components for the photo diodes is allowed only by thedepth of the photo diodes and formation of potentials by implantation.Accordingly, the controllability of spectrum is not high.

Example 1

For solving the above problems, such a configuration is considered whichalso includes photo diodes in a support substrate layer of a rearsurface irradiation type CMOS image sensor as illustrated in FIG. 12.

A CMOS image sensor 1000 illustrated in FIG. 12 is a mode of an imagingelement, and basically has a configuration identical to theconfiguration of the CMOS image sensor 400 illustrated in FIG. 10. Morespecifically, the CMOS image sensor 1000 includes double structure of aconstitution 1001 corresponding to an upper layer and having an imagingfunction, and a support substrate 1002 corresponding to a lower layer asillustrated in FIG. 12.

The constitution 1001 having the imaging function has a configurationsimilar to the configuration of an ordinary rear surface irradiationtype CMOS image sensor. More specifically, a photo diode 1021, wiringlayers 1022, an electrode 1023, a passivation film 1024 and others arelaminated in the constitution 1001. An insulation film 1025, a colorfilter 1026, an on-chip lens 1027 and others are further laminated onthe constitution 1001 having the imaging function on the upper surfaceside of the constitution 1001 as viewed in the figure. The constitution1001 having the imaging function further includes a through electrode1028 extended from the upper side as viewed in the figure to connect theelectrode 1023.

In case of the ordinary CMOS image sensor, the support substrate 1002corresponding to the lower layer is constituted only by a silicon (Si)substrate. On the other hand, the support substrate 1002 of the CMOSimage sensor 1000 in this example includes a photo diode 1031.Accordingly, the support substrate 1002 is constituted by a constitution1011 having an imaging function, and a support substrate 1012.

The constitution 1011 having the imaging function includes a laminationof the photo diode 1031, wiring layers 1032, an electrode 1033, and apassivation film 1034. The support substrate 1012 constituted by asilicon (Si) substrate is laminated. on the lower surface side of thepassivation film 1034 as viewed in the figure. A through electrode 1035is further formed from the upper surface side as viewed in the figure toconnect with the electrode 1033 of the support substrate 1002.

Accordingly, the CMOS image sensor 1000 includes two layers of rearsurface irradiation CMOS image sensors (constitutions having the imagingfunction). In this case, the CMOS image sensor 1000 photoelectricallyconverts incident light not only by the photo diode 1021 in the upperlayer, but also by the photo diode 1031 in the lower layer. Accordingly,the CMOS image sensor 100 achieves a wider variety of photoelectricconversions, and expands the utilization range (application range).

For example, this structure allows the photo diode 1021 in the upperlayer to offer rear surface irradiation type high-sensitivitycharacteristics for the light receiving surface as in the conventionalstructure, and further allows the additional photo diode 1031 in thelower layer to output optical characteristics different from those ofthe upper layer. The distance between the support substrate 1002 and thephoto diode 1021 is equivalent only to the thickness of the wiringlayer. In this case, optical losses decrease, and both of the photodiodes obtain high-sensitivity characteristics. Moreover, in case of theconventional rear surface irradiation type image sensor, light havingpassed through the photo diode is applied to the wiring layer locatedbelow the photo diode, and is reflected thereon and mixed with theadjoining photo diode in some situations. According to the CMOS imagesensor 1000, however, incident light is guided toward a lower layer;therefore, generation of color mixture in the photo diode 1021 in theupper layer is avoided.

As illustrated in FIG. 12, the CMOS image sensor 1000 contains two photodiodes within the same pixel (referring to the same coordinate in thelayout). The CMOS image sensor 1000 may include an individual wiringlayer for each of the photo diodes. Accordingly, the CMOS image sensor1000 achieves driving and reading of the photo diodes in the respectivelayers independently from each other.

Unlike an image sensor having vertical spectrum structure as describedin Japanese Patent Application Laid-Open No. 2011-29453, for example,the CMOS image sensor 1000 optimizes each of the photo diodes in therespective layers in accordance with the purposes of use. Thisconfiguration eliminates the necessity of etching silicon (Si) andforming a transfer gate right beside the photo diode which increases theconfiguration, for example, and allows enlargement of the photo diodes.Accordingly, the CMOS image sensor 1000 increases the number ofsaturated electrons more than the foregoing image sensor having verticalspectrum structure, thereby improving the sensitivity. Furthermore, thenecessity of excavating the side of the photo diodes by etching or othermethods is eliminated; therefore, generation of dark current or whitespots resulting from plasma damage or defects is prevented.

As a result, a plurality of spectra are obtained from the same pixelwithout decreasing the resolution. In addition, advantages of highinfrared sensitivity, and prevention of the foregoing color mixture(reflection from wire) with the photo diode in the upper surface areoffered.

As described above, the configuration illustrated in the example in FIG.12 is easily realized (manufactured) by using an ordinary method formanufacturing a rear surface irradiation type CMOS image sensordescribed below, which method forms the photo diode 1031 different fromthe photo diode 1021 in the support substrate 1002 of the ordinary rearsurface irradiation type CMOS image sensor 1000, rather than simplyjoining completed solid imaging elements.

In other words, the CMOS image sensor 1000 is configured to include thetwo imaging elements on the upper side and the lower side as illustratedin FIG. 12. In this case, the necessity of providing a support substrateor a component such as a spacer between the two imaging elements iseliminated; therefore, the distance between the photo diode 1021 and thephoto diode 1031 is shortened. Accordingly, the sensitivity and thelight receiving band of the photo diode 1031 can be easily designedbased on the thicknesses of the wiring layers 1022 and the like.

A part or all of the pixels in the CMOS image sensor 1000 are thusconstructed; therefore, photoelectric conversion is achievable for aplurality of different wavelength regions of incident light in one pixelwithout decreasing the number of pixels and the pixel size, i.e., whileavoiding deterioration of the image quality. Accordingly, the CMOS imagesensor 1000 more easily provides a wider variety of photoelectricconversion outputs.

The thicknesses of the photo diode 1021 and the photo diode 1031 in theincident light traveling direction (vertical direction in the figure)may be arbitrarily determined. For example, the thickness of the photodiode 1021 and the thickness of the photo diode 1031 may be equivalentto each other, or may be different from each other. The respectivethicknesses of the photo diodes may be designed according to the bandsfor photoelectric conversion.

[Manufacturing Device]

A manufacturing device for manufacturing the CMOS image sensor 1000 thusconstructed is now described.

FIG. 13 is a block diagram illustrating an example of a chiefconstitution of a manufacturing device for manufacturing the CMOS imagesensor 1000. A manufacturing device 1200 illustrated in FIG. 13 includesa control unit 1201 and a manufacturing unit 1202.

The control unit 1201 includes a CPU (Central Processing Unit), a ROM(Read Only Memory), RAM (Random Access Memory), and others, and controlsthe respective units of the manufacturing unit 1202 to execute controlprocesses associated with manufacture of the CMOS image sensor 1000. Forexample, the CPU of the control unit 1201 executes various types ofprocesses under programs stored in the ROM. In addition, the CPU of thecontrol unit 1201 executes various types of processes under programsloaded from a memory unit 1213 to the RAM. The RAM also stores datarequired by the CPU for execution of the processes as necessary.

The manufacturing unit 1202 executes processes associated withmanufacture of the CMOS image sensor 1000 under the control by thecontrol unit 1201. The manufacturing unit 1202 includes a supportsubstrate manufacturing unit 1231, an imaging function componentmanufacturing unit 1232, a front surface processing unit 1233, a joiningunit 1234, a position reversing unit 1235, a polishing unit 1236, anupper layer forming unit 1237, and an electrode forming unit 1238.

The support substrate manufacturing unit 1231 to the electrode formingunit 1238 execute processes in respective steps for manufacturing theCMOS image sensor 1000 as described below under the control by thecontrol unit 1201.

The manufacturing device 1200 includes an input unit 1211, an outputunit 1212, a memory unit 1213, a communication unit 1214, and a drive1215.

The input unit 1211 is constituted by a keyboard, a mouse, a touchpanel, an external input terminal and the like. The input unit 1211receives input of instructions from a user or information from theoutside, and supplies the input to the control unit 1201. The outputunit 1212 is constituted by a display such as CRT (Cathode Ray Tube)display or an LCD (Liquid Crystal Display), a speaker, an externaloutput terminal and the like. The output unit 1212 outputs various typesof information supplied from the control unit 1201 in the form ofimages, audio, or analog signals or digital data.

The memory unit 1213 is constituted by an SSD (Solid State Drive) suchas a flash memory, or a hard disk. The memory unit 1213 storesinformation supplied from the control unit 1201, or reads and suppliesstored information in response to requests from the control unit 1201.

The communication unit 1214 is constituted by a wired LAN (local AreaNetwork) or a wireless LAN interface or a modem, for example, andexecutes communication processing with an external device via a networkincluding the Internet. For example, the communication unit 1214transmits information supplied from the control unit 1201 to acommunications partner, and supplies information received from acommunications partner to the control unit 1201.

The drive 1215 is connected with the control unit 1201 as necessary. Aremovable medium 1221 such as a magnetic disk, an optical disk, amagneto-optical disk, a semiconductor memory or others is attached tothe drive 1215 as necessary. Computer programs read from the removablemedium 1221 via the drive 1215 are installed in the memory unit 1213 asnecessary.

[Flow of Support Substrate Manufacturing Process]

The support substrate manufacturing unit 1231 executes a supportsubstrate manufacturing process to manufacture the support substrate1002. A flow example of the support substrate manufacturing processexecuted by the support substrate manufacturing unit 1231 is nowdescribed with reference to a flowchart shown in FIG. 14. This processis discussed in conjunction with FIG. 15 as necessary. FIG. 15illustrates conditions in respective steps executed in the supportsubstrate manufacturing process.

After the start of the support substrate manufacturing step, the supportsubstrate manufacturing unit 1231 forms the silicon substrate photodiode 1031, a transistor (not shown), the wiring layers 1032, and theelectrode 1033 supplied from the outside under the control by thecontrol unit 1201 in step S1201 (A in FIG. 15). It is assumed hereinthat a rear surface irradiation type structure is produced. However,either the “front surface irradiation” or the “rear surface irradiation”may be selected for the support substrate. For example, an example ofthe front surface irradiation type image sensor is disclosed in JapanesePatent Application Laid-Open No. 2010-41034. An example of the rearsurface irradiation type image sensor is disclosed in Japanese PatentApplication Laid-Open No. 2008-103368.

In step S1202, the support substrate manufacturing unit 1231 forms thepassivation film 1034 (such as SIN or SiO2) for protecting the frontsurface under the control by the control unit 1201, and flattens thepassivation film 1034 by CMP (Chemical Mechanical Polishing) or othermethods (B in FIG. 15).

In step S1203, the support substrate manufacturing unit 1231 joins thesupport substrate 1012 to the constitution 1011 constructed as above andhaving the imaging function by plasma junction or an adhesive, forexample, under the control by the control unit 1201 (C in FIG. 15).

In step S1204, the support substrate manufacturing unit 1231 turns overthe support substrate 1002 thus manufactured under the control by thecontrol unit 1201 (D in FIG. 15).

In step S1205, the support substrate manufacturing unit 1231 polishesthe upper surface of the turned over support substrate 1002 as viewed inthe figure up to the vicinity of the photo diode 1031 by CMP, backgrind, etching or other method, or by combination thereof under thecontrol by the control unit 1201 (E in FIG. 15). In this case, thesupport substrate 1002 corresponds to an ordinary rear surfaceirradiation type image sensor from which a color filter and an on-chiplens (OCL) are removed. Accordingly, the support substrate 1002 iseasily manufactured by a method similar to the method for manufacturingan ordinary rear surface irradiation type image sensor.

[Flow of Manufacturing Process]

The imaging function component manufacturing unit 1232 to the electrodeforming unit 1238 of the manufacturing unit 1202 execute a manufacturingprocess to manufacture the CMOS image sensor 1000 using the supportsubstrate 1002 thus produced. A flow example of the manufacturingprocess executed by the imaging function component manufacturing unit1232 to the electrode forming unit 1238 is now described with referenceto a flowchart shown in FIG. 16. This process is discussed inconjunction with FIG. 17 as necessary. FIG. 17 illustrates conditions inrespective steps executed in the manufacturing process.

After the start of the manufacturing process, the imaging functioncomponent manufacturing unit 1232 forms the photo diode 1021, atransistor (not shown), the wiring layers 1022, and the electrode 1023on an ordinary silicon substrate under the control by the control unit1201 in step S1221 (A in FIG. 17).

In step S1222, the surface processing unit 1233 forms the passivationfilm 1024 (such as SIN and SiO2) for protecting the surface of the upperside of the constitution 1001 thus formed and having the imagingfunction as viewed in A in FIG. 17, and flattens the passivation film1024 thus formed by CMP (chemical mechanical polishing) or other methodsunder the control by the control unit 1201. (B in FIG. 17).

In step S1223, the joining unit 1234 joins the support substrate 1002 tothe constitution 1001 having the imaging function and equipped with thepassivation film 1024 by plasma junction or an adhesive, for exampleunder the control by the control unit 1201 (C in FIG. 17). Asillustrated in C in FIG. 17, the constitution 1001 having the imagingfunction does not have a support substrate at this time, and the siliconsubstrate including the photo diode 1021 is not yet polished and isstill thick. Accordingly, the wafer on which the constitution 1001having the imaging function is formed secures a sufficient thickness;therefore, the probability of breakage of the wafer at the time ofjunction is extremely low. This condition allows the joining unit 1234to easily join the constitution 1001 having the imaging function and thesupport substrate 1002.

In step S1224, the position reversing unit 1235 turns over theconstitution 1001 having the imaging function and the support substrate1002 joined to each other as discussed above under the control by thecontrol unit 1201 (D in FIG. 17)

In step S1225, the polishing unit 1236 polishes the upper surface of theturned over constitution 1001 having the imaging function as viewed inthe figure up to the vicinity of the photo diode 1021 by CMP, backgrind, etching or other method, or by a combination thereof under thecontrol by the control unit 1201 (E in FIG. 17).

In step S1226, the upper layer forming unit 1237 forms the insulationfilm 1025, the color filter 1026, and the on-chip lens (OCL) 1027 on thepolished upper surface under the control by the control unit 1201 (F inFIG. 17).

In step S1227, the electrode forming unit 1238 forms the throughelectrode 1028 for extracting the electrode 1023 toward the uppersurface side as viewed in the figure, and the through electrode 1035 forextracting the electrode 1033 to the upper surface side as viewed in thefigure under the control by the control unit 1201 (G in FIG. 17).

Manufacture of the CMOS image sensor 1000 is completed by theseprocesses. The process flow such as the junction method of the supportsubstrate containing wires is disclosed in Japanese Patent ApplicationLaid-Open No. 2011-204915.

As described above, the manufacturing device 1200 easily manufacturesthe CMOS image sensor 1000 including a plurality of layers by utilizingthe manufacturing steps for manufacturing an ordinary single-layer CMOSimage sensor.

Example 2

According to the characteristics of the present technology, there may beprovided a different film (such as oxide film and other wiring layer)between the photo diodes. It is characteristic that this configurationis also applicable to control of light entering from the photo diode1021 in the upper layer into the photo diode 1031 in the lower layer.When the largest possible amount of light is desired to be introducedinto the photo diode 1031, it is preferable that a light transmissionpath (such as waveguide) is formed in the wiring layers 1022 to reduceoptical losses. On the contrary, when reduction of light entering thephoto diode 1031 is desired, a part of the light may be blocked by wires(such as Cu, Al, and W) of the wiring layers 1022. In controlling thewavelength of light entering the photo diode 1031, a structure absorbinga large amount of particular wavelength light (such as Poly-Si capableof absorbing short wavelength light) may be provided. (Alternatively, alight absorber such as a color filter may be used.)

[Manufacturing Device]

A manufacturing device for manufacturing the CMOS image sensor 1000 thusconstructed is now described.

FIG. 18 is a block diagram illustrating an example of a chiefconfiguration of the CMOS image sensor 1000 thus constructed. Amanufacturing device 1300 illustrated in FIG. 18 has basically the sameconfiguration as that of the manufacturing device 1200 illustrated inFIG. 13, and includes a control unit 1301 and a manufacturing unit 1302.

The control unit 1301 is a processing unit similar to the control unit1201, and controls operation of the manufacturing unit 1302. Themanufacturing unit 1302 executes processes associated with manufactureof the CMOS image sensor 1000 under the control of the control unit 1301similarly to the manufacturing unit 1202.

The manufacturing unit 1302 includes a support substrate manufacturingunit 1331, an imaging function component manufacturing unit 1332, anoptical path forming unit 1333, a front surface processing unit 1334, ajoining unit 1335, a position reversing unit 1336, a polishing unit1337, an upper layer forming unit 1338, and an electrode forming unit1339.

The support substrate manufacturing unit 1331 is a unit similar to thesupport substrate manufacturing unit 1231. The imaging functioncomponent manufacturing unit 1332 is a processing unit similar to theimaging function component manufacturing unit 1232. The front surfaceprocessing unit 1334 is a processing unit similar to the front surfaceprocessing unit 1233. The joining unit 1335 is a processing unit similarto the joining unit 1234. The position reversing unit 1336 is aprocessing unit similar to the position reversing unit 1235. Thepolishing unit 1337 is a processing unit similar to the polishing unit1236 The upper layer forming unit 1338 is a processing unit similar tothe upper layer forming unit 1237. The electrode forming unit 1339 is aprocessing unit similar to the electrode forming unit 1238.

The manufacturing unit 1300 includes an input unit 1311, an output unit1312, a memory unit 1313, a communication unit 1314, and a drive 1315.These units are similar to the input unit 1211 to the drive 1215. Aremovable medium 1321 similar to the removable medium 1221 is attachedto the drive 1315 as necessary.

[Flow of Manufacturing Process]

The support substrate manufacturing unit 1331 executes a supportsubstrate manufacturing process (FIG. 14) similar to the processesperformed by the support substrate manufacturing unit 1231 under thecontrol by the control unit 1301 to manufacture the support substrate1002.

The imaging function component manufacturing unit 1332 to the electrodeforming unit 1339 of the manufacturing unit 1302 execute themanufacturing process to manufacture the CMOS image sensor 1000 usingthe support substrate 1002 thus produced. A flow example of themanufacturing process executed by the imaging function componentmanufacturing unit 1332 to the electrode forming unit 1339 is nowdescribed with reference to a flowchart shown in FIG. 19. This processis discussed in conjunction with FIG. 20 as necessary. FIG. 20illustrates conditions in respective steps executed in the manufacturingprocess.

After the start of the manufacturing process, the imaging functioncomponent manufacturing unit 1332 forms the photo diode 1021, atransistor (not shown), the wiring layers 1022, and the electrode 1023on an ordinary silicon substrate under the control by the control unit1301 in step S1301 similarly to step S1221 (A in FIG. 20).

In step S1302, the optical path forming unit 1333 etches a portion (suchas an etching portion 1341 in B in FIG. 20) of the wiring layers 1022 incorrespondence with a position (optical path) into which a waveguide ora light absorber is desired to be inserted under the control by thecontrol unit 1301 (B in FIG. 20).

In step S1303, the optical path forming unit 1333 embeds the waveguide(high refractive index material) or a light absorber (color filter, ormaterial whose absorptivity is dependent on wavelengths such as Poly-Si)(embedding member 1342 in C in FIG. 20) into the etching portion 1341 byALD (Atomic Layer Deposition), CVD (Chemical Vapor Deposition), PVD(Physical Vapor Deposition), application or other methods under thecontrol by the control unit 1301 (C in FIG. 20). It is assumed in thisexample that a film of silicon nitride SIN (refractive index: about 1.8to 2) formed by ALD is used. SIN has a higher refractive index incomparison with surrounding wiring layers (refractive index: 1.5 orlower in case of oxide film), and has excellent condensingcharacteristics. Moreover, this material is an inorganic membrane, andthus is characteristic in sufficient durability for enduring heat orpressure when heat or pressure is applied in the subsequentmanufacturing steps. However, the film to be embedded may be an organicmembrane.

In step S1304, the optical path forming unit 1333 removes an unnecessaryportion (etching portion 1343 in D in FIG. 20) such as an area betweenpixels in the embedding member 1342 (waveguide member or light absorber)by etching under the control by the control unit 1301 (D in FIG. 20).

For example, SIN has a high refractive index, and thus may cause colormixture when connected with adjacent pixels. Accordingly, the opticalpath forming unit 1333 removes the etching portion 1343 between thepixels as discussed herein. This process prevents transmission of lightto the adjacent pixels via the embedding member 1342 (such as SIN).However, this process may be omitted when not needed.

Respective processes in steps S1305 to S1310 are executed by the frontsurface processing unit 1334 to the electrode forming unit 1339 underthe control by the control unit 1301 in a manner similar to therespective processes in steps S1222 to S1227 in FIG. 16 (E to K in FIG.20).

By executing the foregoing manufacturing process, the manufacturingdevice 1300 completes manufacture of a constitution 1351 having animaging function and containing a waveguide (or light absorber) in thewiring layers 1022. In other words, the manufacturing device 1300completes manufacture of the CMOS image sensor 1000 including theconstitution 1351 having the imaging function.

Example 3

The number of layers of photo diodes may be increased to three or moreby a similar method. FIG. 21 illustrates a constitution example of aCMOS image sensor having three layers of photo diodes. A CMOS imagesensor 1400 illustrated in FIG. 21 includes an upper layer 1401, amiddle layer 1402, and a lower layer 1403. Each of the upper layer 1401to the lower layer 1403 may contain a photo diode. Accordingly, threephoto diodes are formed at the maximum within one pixel.

The CMOS image sensor 1400 only adds one layer of a constitution havingthe imaging function to the CMOS image sensor 1000 discussed above.Accordingly, the CMOS image sensor 1400 may be manufactured by using themanufacturing method of the foregoing CMOS image sensor 1000.

More specifically, in step S1203 of the support substrate manufacturingprocess discussed with reference to the flowchart in FIG. 14, thesupport substrate 1012 constituted by a silicon substrate is joined tothe constitution 1011 having the imaging function. According to theprocess in this example, however, a support substrate including aconstitution having the imaging function is joined to the constitution1011 having the imaging function in a manner similar to the process instep S1223 in FIG. 16.

Accordingly, three or more layers of photo diodes formed in differentsilicon layers are obtained by recursively repeating the processes. Thewavelengths of light received by the respective layers(photoelectrically converted) are controlled by controlling therespective film thicknesses of silicon (Si) containing the photo diodes.For example, the respective photo diodes may be configured to receivelights in blue, green, and red in this order from above (by utilizingdifferent Si absorptivity for each color). Moreover, this configurationis considerably advantageous in receiving light in the infrared range,and realizes the advantage of high sensitivity.

The pixel sizes of the respective layers are not required to be thesame.

An example of driving/signal processing is now described.

Example 4

An independent wiring layer may be provided for each of the plural photodiodes laminated as discussed above. This configuration increases thedegree of freedom in driving the respective photo diodes. For example,in case of the double-layer CMOS image sensor 1000 illustrated in A inFIG. 22, a signal value obtained by the photo diode 1021, and a signalobtained by the photo diode 1031 may be individually output as shown inB in FIG. 22, or may be synthesized and output as shown in C in FIG. 22.

When the signal values of the upper and lower photo diodes aresynthesized and output as shown in C in FIG. 22, the light receivingsensitivity increases. Accordingly, this configuration may be used as ahigh sensitivity mode. For example, a high output is obtained for lightnot sufficiently photoelectrically converted by one photo diode, such asinfrared light.

Silicon (Si) has a higher light absorption coefficient on the shortwavelength side; therefore, the upper surface absorbs a larger amount ofshort wavelength light with respect to the light entrance surface. Inother words, the spectrum characteristics differ between the photo diode1021 in the upper layer and the photo diode 1031 in the lower layer.More specifically, the photo diode 1031 in the lower layer has suchspectrum characteristics where a peak lies on the long wavelength sidein comparison with the photo diode 1021 in the upper layer as indicatedin B in FIG. 22 (because the short wavelength is easily absorbed by thephoto diode 1021 in the upper layer).

In case of the example in B in FIG. 22, a green color filter is providedbelow the on-chip lens. Accordingly, light entering the photo diode 1021in the upper layer is green light. In this case, the short wavelengthside is particularly absorbed while light is traveling through theinside of the photo diode 1021; therefore, light entering the photodiode 1031 in the lower layer shifts to the long wavelength side withrespect to the upper layer.

Accordingly, when the signal value of the photo diode 1021 in the upperlayer and the signal value of the photo diode 1031 in the lower layerare output without synthesis, signals of plural wavelength lights areproduced for one pixel.

As discussed in Example 2, wavelength control may be further achieved byinserting a wavelength-dependent light absorber between photo diodes.

In signal processing, obtaining data which contains plural spectra fromone pixel offers great advantages. For example, visible light may bephotoelectrically converted by the upper surface photo diode, and nearinfrared light may be photoelectrically converted by the lower surfacephoto diode. FIG. 23 illustrates an example of color arrangement.Initially, red (R), green (G), and blue (B) color filters are providedin A in FIG. 23. An upper surface photo diode (PD) 1501photoelectrically converts components in the wavelength region (color)having passed through the color filters. A lower surface photo diode1502 only receives components not absorbed by the upper surface photodiode 1501, and thus photoelectrically converts components in a longerwavelength region than the wavelength region of the light absorbed bythe upper surface photo diode 1501. In case of the example in A in FIG.23, a red (R) component is photoelectrically converted by the uppersurface photo diode 1501 for a pixel corresponding to the red (R)filter, while an infrared (including near infrared) (IR) component isphotoelectrically converted by the lower surface photo diode 1502 forthe same pixel. On the other hand, a green (G) component isphotoelectrically converted by the upper surface photo diode 1501 for apixel corresponding to the green (G) filter, while a red (R′) componentis photoelectrically converted by the lower surface photo diode 1502 forthe same pixel.

In this case, a blue (B) component is photoelectrically converted by theupper surface photo diode 1501 for a pixel corresponding to the blue (B)filter, while no photo diode is provided below the same pixel. This isbecause substantially no component of light enters the lower surfacephoto diode 1502 when only the blue component corresponding to a shortwavelength enters the upper surface photo diode 1501.

A larger number of wires may be provided between photo diodes asillustrated in B in FIG. 24, for example, instead of providing the lowersurface photo diode 1502. Alternatively, (a part of pixels of) the lowersurface photo diode 1502 may be used as OPB (optical black) asillustrated in B in FIG. 23, for example. In this case, the photo diode1031 may be used as OPB by intentional and complete light shieldingusing a light shielding film 1511 or the like made of material nottransmitting light as illustrated in C in FIG. 24, for example. The OPBprovided within the pixel area allows estimation of a black level or acolor mixture amount for each position.

FIG. 25 illustrates another layout. Red (R), green (G), and white (W)color filters are provided in A in FIG. 25. A red (R) component isphotoelectrically converted by an upper surface photo diode 1531 for apixel corresponding to the red (R) filter, while an infrared (includingnear infrared) (IR) component is photoelectrically converted by a lowersurface photo diode 1532 for the same pixel. A white (W) component(i.e., all components) is photoelectrically converted by the uppersurface photo diode 1531 for a pixel corresponding to the white (allcolor transmission) (W) filter, while an infrared (IR′) component or ared (R′) component contained in incident light as a component notphotoelectrically converted by the upper surface photo diode 1531 andhaving a long wavelength reaching the lower surface photo diode 1532 isphotoelectrically converted by the lower surface photo diode 1532 forthe same pixel. A green (G) filter is photoelectrically converted by theupper surface photo diode 1531 for a pixel corresponding to the green(G) filter, while a red (R″) component is photoelectrically converted bythe lower surface photo diode 1532 for the same pixel.

This example is characterized in that the same color of lights receivedby the photo diode in the upper surface (white in case of the example inA in FIG. 25) can be changed to different colors of lights when receivedby the photo diode in the lower surface (red and infrared in the examplein A in FIG. 25). In this case, the wavelength may be controlled byusing the light absorber or the like discussed in Example 2, or bychanging the position of the photo diode as illustrated in the examplein FIG. 26. (A longer wavelength component is more dominant as the depthof the silicon (Si) position becomes larger from the on-chip lens.)

The arrangement pattern of the colors of the color filters containingthe white (W) color filter is not limited to the example in A in FIG.25, but may be arbitrarily determined. In addition, the number of colorsof the color filters may be arbitrarily determined, such as four ormore. For example, as illustrated in B in FIG. 25, red (R), green (G),blue (B), and white (W) color filters may be provided. In this case, red(R), green (G), blue (B), and white (W) components are photoelectricallyconverted by the upper surface photo diode 1533 for each pixel.

On the other hand, components to be photoelectrically converted by thelower surface photo diode 1534 are only required to be contained in alonger wavelength region than the wavelength region of the components tobe photoelectrically converted by the upper surface photo diode 1533.For example, as illustrated in B in FIG. 25, infrared (IR) componentsmay be photoelectrically converted by the lower surface photo diode 1534for all the pixels regardless of the colors of the color filters. Thebands to be photoelectrically converted by the foregoing lower surfacephoto diode may be controlled based on the position, thickness and thelike in the depth direction where the lower surface photo diode isformed, or controlled by a light absorber provided between the uppersurface photo diode and the lower surface photo diode (in a wiringlayer, for example).

Signals obtained from these photo diodes may be individually read andadded as discussed above, or processed without addition for signalprocessing. The charge reading timing by the photo diode 1021 and thecharge reading timing of the photo diode 1031 may be the same, or may bedifferent from each other.

FIG. 27 illustrates an example of a block diagram realizing an imagingelement according to the present technology. An imaging device 1600illustrated in FIG. 27 images a subject, and outputs an image of thesubject as electric signals (image data). As illustrated in FIG. 27, theimaging device 1600 includes a lens system 1601, an imaging element1602, an A/D converting unit 1603, a clamp unit 1604, a demosaic unit1605, a linear matrix unit 1606, a gamma correcting unit 1607, aluminance chroma signal generating unit 1608, and a video interface (IF)1609.

A CMOS image sensor (such as CMOS image sensor 1000 or 1400) to whichthe present technology has been applied is applicable to the imagingelement 1602 to obtain high sensitivity characteristics providing aplurality of spectra in the vertical direction for one pixel.

The A/D converting unit 1603 converts analog signals of an image of asubject photoelectrically converted by the imaging element 1602 intodigital values. The clamp unit 1604 subtracts a black level from thedigital data (image data) of the image of the subject supplied from theA/D converting unit 1603. The demosaic unit 1605 supplements the imagedata supplied from the clamp unit 1604 with color signals as necessary.The linear matrix unit 1606 increases color reproducibility and the likeby applying linear matrix to the image data supplied from the demosaicunit 1605 as necessary. The gamma correcting unit 1607 executes gammacorrection for naturalizing luminance expression of the image datasupplied from the linear matrix unit 1606. The luminance chroma signalgenerating unit 1608 generates luminance signals and chroma signals fromthe image data supplied from the gamma correcting unit 1607. The videointerface 1609 outputs the luminance signals and the chroma signalssupplied from the luminance chroma signal generating unit 1608.

Example 5

Utilization and application example of the signal processing afterindividual extraction of signals in the manner discussed in Example 4 isnow explained.

1. Color Reproducibility Improvement

For example, suppose that RGB are obtained by the upper surface photodiode, and that colors in different wavelength bands are obtained by thelower surface photo diode. In this case, the number of types of spectra(colors) usable for signal processing further increases. For example,spectra (colors) usable for imaging such as emerald as well as RGB maybe added to improve color reproducibility. This method establishes aplurality of colors for the same pixel; therefore, color reproducibilityimproves without lowering the resolution.

When the number of usable pixels increases, input from the imagingelement 1602 increases in the imaging device 1600 illustrated in FIG.27. Accordingly, the number of coefficients allowed to be used by thelinear matrix unit 1606 increases; therefore, color reproducibilityimproves.

For example, when wavelength components to be received(photoelectrically converted) are only R, G, and B, the linear matrixunit 1606 only applies linear matrix of a mode A shown in the followingequation (1) (left side: values after linear matrix, right side:calculation formula).

$\begin{matrix}{\left\lbrack {{Mathematical}\mspace{14mu} {Formula}\mspace{14mu} 1} \right\rbrack \mspace{464mu}} & \; \\{{{Mode}\mspace{14mu} A\text{:}\mspace{14mu} \begin{pmatrix}{R\_ Im} \\{G\_ Im} \\{B\_ Im}\end{pmatrix}} = {\begin{pmatrix}{1 - \alpha - \beta} & \alpha & \beta \\\delta & {1 - \gamma - \delta} & \gamma \\ɛ & \zeta & {1 - ɛ - \zeta}\end{pmatrix}\begin{pmatrix}R \\G \\B\end{pmatrix}}} & (1)\end{matrix}$

On the other hand, when emerald (E) is received (photoelectricallyconverted) as well as R, G and B, for example, the linear matrix unit1606 applies linear matrix of a mode B indicated by the followingequation (2).

$\begin{matrix}{\left\lbrack {{Mathematical}\mspace{14mu} {Formula}\mspace{14mu} 2} \right\rbrack \mspace{464mu}} & \; \\{{{Mode}\mspace{14mu} B\text{:}\mspace{14mu} \begin{pmatrix}{R\_ Im} \\{G\_ Im} \\{B\_ Im}\end{pmatrix}} = {\begin{pmatrix}{1 - \alpha - \beta - \varphi} & \alpha & \beta & \varphi \\\delta & {1 - \gamma - \delta - \theta} & \gamma & \theta \\ɛ & \zeta & {1 - ɛ - \zeta - \Omega} & \Omega\end{pmatrix}\begin{pmatrix}R \\G \\B \\E\end{pmatrix}}} & (2)\end{matrix}$

In this case, the number of coefficients allowed to be used increases.Accordingly, output having a higher degree of freedom is obtained afterlinear matrix; therefore, color reproducibility is expected to improve.

2. Light Source Estimation Accuracy Improvement

(Imaging Device)

According to an imaging device like a camera, such a method has beenwidely used which estimates surrounding lighting at the time of imaging(such as fluorescent light, incandescent light, and white LED), andperforms imaging in accordance with lighting (change of color target,for example). However, with rise in the number of new types of lightsources such as white LED (Light Emitting Diode), the level ofdifficulty in estimating the type of the light source has been rising.

According to the CMOS image sensor 1000 discussed above, RGB areobtained by photoelectric conversion using the upper surface photo diode1021, and color components in different wavelength bands are obtained byphotoelectric conversion using the lower surface photo diode 1031. Whenthe light source is difficult to be estimated only based on signalvalues obtained by the upper surface photo diode 1021, the light sourcemay be estimated based on signal values obtained by the lower surfacephoto diode 1031. This method increases the accuracy of light sourceestimation.

For example, suppose that conventional light source estimation iscarried out based on output ratios of R/G and B/G, for example. When alight source 1 and a light source 2 having different light source outputspectra are used, different values are not necessarily obtained for R/Gand B/G. The output is not obtained for each light wavelength, butobtained as an integral factor determined by multiplication of spectrumcharacteristics of a sensor and a light source. Accordingly, whenintegral values are the same, distinction between different outputs forrespective wavelengths is difficult. According to the presenttechnology, however, additional spectrum characteristics are obtained bythe lower surface photo diode. Thus, the characteristics of R/IR may bedifferent for the lower surface even when R/G and B/G are equivalent forthe upper surface, for example. In this case, the accuracy of lightsource estimation increases. In addition, a plurality of colors areestablished for the same pixel. Accordingly, this improvement isrealized without lowering the resolution.

3. Application to Medical Equipment

The use of wavelengths including near infrared wavelength is alsostarted in the medical field as wavelength regions expected to improveanalysis accuracy and the like. However, problem such as low infraredsensitivity are arising as discussed above.

For example, there is a method for hemoglobin analysis based oninformation about a plurality of wavelengths. A method disclosed inJapanese Patent No. 2932644, for example, measures absorptivity changesin respective wavelengths by applying light in different two pairs ofwavelength groups to biological tissues in a near infrared region wherean absorptivity change with a change from oxygenation to deoxygenationof hemoglobin and an absorption change with an oxidization-reductionstate change of cytochrome oxidase are both produced. Then, this methodcalculates a hemoglobin amount fluctuation only based on a lightabsorption coefficient of oxygenation type hemoglobin and a lightabsorption coefficient of deoxygenation type hemoglobin in therespective wavelengths as light absorption coefficients on theassumption that light absorptivity changes in the respective wavelengthgroups are all dependent on oxygenation-deoxygenation, and calculates afluctuation amount of cytochrome oxidase based on the difference betweenhemoglobin amount fluctuation calculation values of the two pairs ofwavelength groups.

According to this method, one wavelength is analyzed for one pixel.Accordingly, this method requires irradiation of a plurality ofwavelength lights, or use of a plurality of near infrared pixels. Inthis case, miniaturization of an imaging element and an imaging deviceis difficult.

When the present technology is applied to medical equipment asillustrated in FIG. 28 (such as healthcare device, capsule endoscope,and DNA chip), output of a plurality of wavelength components for asingle pixel is obtained from single light.

A healthcare device 1620 illustrated in A in FIG. 28 includes an imagingdevice 1621 and an analyzing device 1622. The imaging device 1621 imagesa human body 1631 (such as finger) corresponding to a specimen, anddetects signals of plural wavelength lights as discussed above. Theanalyzing device 1622 obtains predetermined analysis on medicaltreatment such as hemoglobin analysis.

A capsule endoscope 1640 illustrated in B in FIG. 28 is a small-sizeddevice swallowed by an examinee or the like for imaging a state of thehuman body within the body. The capsule endoscope 1640 contains animaging device 1641.

The imaging device 1600 (FIG. 27) to which the present technology hasbeen applied is used as an imaging device for these systems. Thesesystems allow a simultaneous acquisition of wavelength dependency whilemaintaining high resolution. The obtained wavelength dependency may beused for healthcare and pathology analysis such as hemoglobin analysisdiscussed above.

Moreover, according to the present technology capable of providing aplurality of optical characteristics for one pixel, opticalcharacteristics are more securely obtained even in opticalcharacteristics analysis for molecules and DNA where the molecule sizeis contained in a single pixel. (Plural spectra for the same moleculeare obtained by the same pixel.)

4. Application to ToF

There is a method called ToF (Time of Flight) for obtaining depthinformation using infrared light or the like (for example, see JapanesePatent Application Laid-Open No. 2012-49547). When the presenttechnology is applied to this method, the degree of accuracy increases.

An electronic device 1650 illustrated in FIG. 29 includes an infraredlight irradiating unit 1651 and infrared light irradiating unit 1652 forirradiating different wavelength infrared lights. When plural differentwavelength infrared lights are applied to a measurement target 1661,distance measurement is more securely achieved by obtaining output inone of the wavelength bands even in such a case where the otherwavelength band is not measured by a large quantity of noisesuperimposed on the other wavelength band by the effect of externallight (noise source 1662).

When the present technology is applied to an imaging element 1653 of theelectronic device 1650, a plurality of infrared lights are sampled forone pixel. Accordingly, improvement of accuracy is expected withoutlowering the resolution.

5. Elimination of IR Cut Filter

There may be a case where elimination of an IR cut filter is needed forthe purpose of receiving infrared light (IR), cost advantages, heightreduction and others. In addition, insertion ON/OFF of an IR cut filter(IRCF) may be switched by using a mechanical unit within a module.According to a layout illustrated in A in FIG. 30, RGB output containingIR is obtained by an upper surface PD 1671, while the remaining IRcomponents are output by a lower surface PD 1672. In this case, IRcomponents are reduced or removed by subtracting output of the lower PD1672 from the output of the upper surface PD 1671. At the time ofremoval, individual outputs may be multiplied by correctioncoefficients, or calculation such as linear matrix may be performedusing infrared information on other colors and the like.

As illustrated in B in FIG. 30, an imaging module 1680 including theCMOS image sensor 1000 as an imaging element is configured to controlinsertion of an IR cut filter (IRCF) 1683 using a mechanical unit. Lightenters the imaging module 1680 via a condensing lens 1681.

While the IR cut filter 1683 is inserted, the infrared component of theincident light is cut off. Accordingly, light components not absorbed bythe RGB on the upper surface are photoelectrically converted by thelower surface diode. In this case, the output from the upper surface PDand the output from the lower surface PD may be synthesized.

On the other hand, when the IR cut filter is absent, the infraredcomponent enters both the upper surface PD and the lower surface PD. Inthis case, the rate of the infrared component entering the lower surfacephoto diode is higher. Accordingly, the output from the lower surface PDmay be subtracted from the signal from the upper surface PD as discussedabove. As can be understood, the control method may be switched inaccordance with the condition of the IR cut filter 1683.

Example 6

The upper surface PD and the lower surface PD not only have differentwavelength peaks, but also provide different outputs. When the chargeaccumulation time and the photo diode design are the same, the outputfrom the lower surface photo diode is lower than that from the uppersurface photo diode. This is because only light not absorbed by theupper surface photo diode enters the lower surface photo diode. Based onthis difference, imaging may be performed by using the value of thelower surface photo diode at the time of saturation of the upper surfacephoto diode. More specifically, charges may be initially read from theupper surface diode, and then may be read from the lower surface diodeat the time of saturation of the upper surface diode (excess ofpredetermined threshold, for example). In this case, the wavelengthpeaks of the spectra are different as discussed in conjunction with theexample in B in FIG. 22; therefore, it is preferable that differentcoefficients of linear matrix are used for the upper surface PD and forthe lower surface PD.

FIG. 31 shows a flow example at the time of selection of linear matrix.

In step S1601, the linear matrix unit 1606 obtains upper surface PDoutput, determines whether or not the upper surface PD output issaturated based on the value, and determines which of the upper surfacePD and the lower surface PD is used based on the determination result.

When it is determined that the upper surface PD output is saturated, theprocess proceeds to step S1602.

In step S1602, the linear matrix unit 1606 allows read of the lowersurface PD output, and obtains image data created based on the outputfrom the demosaic unit 1605. After completion of the process in stepS1602, the process proceeds to step S1604.

When it is determined that the upper surface PD output is not saturatedin step S1601, the process proceeds to step S1603. In step S1603, thelinear matrix unit 1606 allows read of the upper surface PD output, andobtains image data created based on the output from the demosaic unit1605. After completion of the process in step S1603, the processproceeds to step S1604.

In step S1604, the linear matrix unit 1606 determines which of the uppersurface and the lower surface is used for other colors.

In step S1605, the linear matrix unit 1606 selects linear matrix inaccordance with the determination result. This is because the optimumvalue varies with combinations of spectrum characteristics of assumedpixels.

The linear matrix unit 1606 multiplies the image data by the selectedlinear matrix to improve color reproducibility and the like, and allowsexecution of gamma correction. Then, the linear matrix unit 1606generates luminance signals and color difference signals, and outputsthese signals from the video interface (IF) 1609 in step S1606.

The sensitivity difference between the upper surface and the lowersurface may be controlled based on control of incident light by lightshielding using a light absorber or a wiring layer as described inExample 2, or control of the amount of photoelectric conversion byindividual control of charge accumulation time. Alternatively,correction of the sensitivity difference for each color may be executedbased on accumulation time. (the output from the lower surface PDdecreases as the wavelength of light entering the upper surface PD isshorter; therefore, correction is made based on accumulation time so asto eliminate wavelength dependency.)

FIG. 32 illustrates this example. In case of the example illustrated inFIG. 32, the accumulation time is uniform for each color of RGB(accumulation time R′=G′=B′) for the upper surface PD 1671. However, theaccumulation time different for each of R′, G′, and B′ (accumulationtime R′<G′<B′) is set for the lower surface PD 1692.

This method sets the sensitivity of the lower surface photo diode 1692(light amount difference/accumulation time difference) to 1/16 of thecorresponding sensitivity of the upper surface photo diode 1671, forexample. In this case, 16 times larger amount of light (light enteringon-chip lens) can be received by the lower surface even when the uppersurface is saturated. Accordingly, the dynamic range expands to 16 timeswider.

When the upper surface photo diode 1671 is saturated at the time ofreading in signal processing, the lower surface photo diode 1672 isselected. The light amount difference and the sensitivity difference maybe adjusted by varying gains and linear matrix so that color componentsand luminance components do not change after combination of the signalsof the upper surface photo diode 1671 and the signals of the lowersurface photo diode 1672.

The magnification of the light amount difference may be arbitrarilydetermined by the foregoing method. FIG. 33 illustrates an example of achief configuration of an imaging device when HDR is executed.

An imaging device 1700 illustrated in FIG. 33 images a subject, andoutputs an image of the subject as electric signals (image data). Asillustrated in FIG. 33, the imaging device 1700 includes a lens system1701, an imaging element 1702, an A/D converting unit 1703, a clamp unit1704, a memory unit 1705, a magnification calculating unit (HDRcalculating unit) 1706, an upper surface/lower surface synthesizing unit1707, a demosaic unit 1708, a linear matrix unit 1709, a gammacorrecting unit 1710, a luminance chroma signal generating unit 1711,and a video interface (IF) 1712.

In other words, in comparison with the imaging device 1600 (FIG. 27),the imaging device 1700 additionally includes the memory unit 1705, themagnification calculating unit 1706, and the upper surface/lower surfacesynthesizing unit 1707 as well as the lens system 1701 to clamp unit1704, and the demosaic unit 1708 to the video interface (IF) 1712corresponding to the lens system 1601 to the video interface (IF) 1609of the imaging device 1600, respectively.

The memory unit 1705 stores each of upper surface PD output and lowersurface PD output. The magnification calculating unit 1706 multipliesoutput data of the lower surface PD by a gain of the sensitivitydifference between the lower surface PD and the upper surface PD. Theupper surface/lower surface synthesizing unit 1707 synthesizes outputdata of the upper surface PD and output data of the lower surface PDmultiplied by the gain. According to this process, there are choicesincluding the use of the lower surface PD output at the time ofsaturation of the upper surface PD output as discussed in conjunctionwith FIG. 31, for example.

Selection may be made based on a threshold or a reference (threshold)for other color pixels rather than saturation. Then, the demosaic unit1708 supplements color signals as necessary, while the linear matrixunit 1709 applies linear matrix. It is preferable that the linear matrixapplied herein is varied according to which of the upper surface PD andthe lower surface PD is used and how the selected surface PD is used forthe respective colors (because spectrum characteristics are differentbetween the upper surface and the lower surface). More specifically, thelinear matrix is selected based on the flow discussed in conjunctionwith FIG. 31.

The linear matrix unit 1709 applies linear matrix in the mode A shown inEquation (1) when the pixels of the upper surface PD (R, G, B) are usedfor all components, and changes the values of the linear matrix to amode C shown in Equation (3) when the pixel (G′) of the lower surface PDis used only for G, for example.

$\begin{matrix}{\left\lbrack {{Mathematical}\mspace{14mu} {Formula}\mspace{14mu} 3} \right\rbrack \mspace{464mu}} & \; \\{{{Mode}\mspace{14mu} C\text{:}\mspace{14mu} \begin{pmatrix}{R\_ Im} \\{G\_ Im} \\{B\_ Im}\end{pmatrix}} = {\begin{pmatrix}{1 - \alpha^{\prime} - \beta^{\prime}} & \alpha^{\prime} & \beta^{\prime} \\\delta^{\prime} & {1 - \gamma^{\prime} - \delta^{\prime}} & \gamma^{\prime} \\ɛ^{\prime} & \zeta^{\prime} & {1 - ɛ^{\prime} - \zeta^{\prime}}\end{pmatrix}\begin{pmatrix}R \\G^{\prime} \\B\end{pmatrix}}} & (3)\end{matrix}$

Example 7

The advantage of accuracy increase is offered by combining the method ofToF (Time of Flight) (for example, see Japanese Patent ApplicationLaid-Open No. 2012-49547) for obtaining depth information using infraredlight and the like as discussed above.

For example, the accuracy increases even when the light emissionwavelength is one wavelength in the example shown in FIG. 29. ToF is amethod which applies LED in one wavelength band to a subject, andmeasures a distance by capturing a phase difference of light reflectedat that time. In this case, ToF applies LED while varying the lightemission intensity in time series, and determines the distance based ona phase condition at the time of entrance of light applied to thesubject into an imaging element. As illustrated in FIG. 34, the numberof sampling in time series increases by varying shutter timing for lightreceiving upper and lower PDs (PD1 and PD2), thereby increasing theaccuracy while maintaining the resolution. Moreover, increase in thenumber of sampling contributes determination of a dynamic subject.

The advantage of accuracy increase is similarly provided by using otherdepth determination methods as well as ToF. For example, this method isapplicable to a distance detection system which projects infrared lightas disclosed in US patent “US 2010/0118123 A1”. More specifically,lights are individually received by using a plurality of photo diodesprovided for the same pixel while reducing effect of external light byusing a light source emitting a larger number of wavelength types. Inthis case, even when a noise source is produced by the external light inone of the wavelength bands, positions can be measured in the otherbands. Moreover, the present technology which includes a transfer gateand a wiring layer for each photo diode is allows shutter timing to beindividually varied. Accordingly, the present technology is alsoappropriate for a dynamic subject, as a technology capable of handling adynamic subject while maintaining the resolution by shifting samplingtiming and obtaining plural sets of information on timing for one pixel.

Example 8

The upper surface photo diode and the lower surface photo diode mayinclude different wiring layers as illustrated in A in FIG. 35. However,the wiring layer for driving may be shared with each other. For example,the wiring layer of the support substrate may be used for driving theupper surface photo diode. This is a method disclosed in Japanese PatentLaid-Open No. 2011-204915, for example. This method reduces thethickness of the wiring layer between the upper surface photo diode andthe lower surface photo diode, and allows entrance of light into thelower surface photo diode with smaller optical losses.

The wire connection method may be a method disclosed in Japanese PatentApplication Laid-Open No. 2011-204915 as illustrated in B in FIG. 35,for example. Alternatively, blue color may be used as a connectingelectrode extraction portion (C in FIG. 35, for example) based on thefact that the sensitivity of the lower surface photo diode below theblue color filter is not expected as discussed above. Sharing electrodeswithin the pixel area can reduce the chip size. Moreover, as illustratedin D in FIG. 35, for example, an element division area may be used as anelectrode extraction portion. In this case, a contact and an electrodeare disposed around the optical path of the pixels. Accordingly, thisconfiguration produces barrier for color mixture with adjacent pixels,thereby contributing to color mixture improvement.

Example 9

The color filter 1026 included in the structure of the CMOS image sensor1000 illustrated in FIG. 12 may be replaced with an organicphotoelectric conversion film, for example. A green component, forexample, is extracted by photoelectric conversion using the organicphotoelectric conversion film. The light transmitted from the organicphotoelectric conversion film contains blue and red components. Thewavelength bands of blue and red are separated; therefore, blue and redare easily separated into individual components by the upper surfacediode and the lower surface diode. Accordingly, excellent colorreproducibility is realized by easy separation of spectra for eachcolor. In addition, a reading electrode or the like is not disposedbeside the photo diode as described in Japanese Patent ApplicationLaid-Open No. 2011-29453. In this case, the area of the photo diodeincreases; therefore, the number of saturated electrons and sensitivityimprove. Furthermore, the necessity for excavating silicon is eliminatedin positioning the gate electrode. Accordingly, dark current, whitespots and the like are not generated by damages given to an Si substratecaused by etching.

An example as an electronic device is now described.

Example 10

The use of wavelengths including near infrared wavelength is alsostarted in the medical field as wavelength regions expected to improveanalysis accuracy and the like. However, problems such as low infraredsensitivity are arising as discussed above. Moreover, one wavelength isanalyzed for by pixel in conventional methods; therefore, irradiation oflight of a plurality of wavelengths, or use of a plurality of nearinfrared pixels is required in a method for analyzing hemoglobin basedon information about a plurality of wavelengths (method described inJapanese Patent No. 2932644, for example). In this case, miniaturizationof imaging elements and imaging devices becomes difficult.

When the present technology is applied to medical equipment illustratedin FIG. 28 (such as healthcare device, capsule endoscope, and DNA chip),output of plural wavelength components for a single pixel is obtainedfrom single light. In other words, this method allows a simultaneousacquisition of wavelength dependency while maintaining high resolution.The obtained wavelength dependency may be used for healthcare andpathology analysis such as hemoglobin analysis discussed above.

Moreover, according to the present technology capable of providing aplurality of optical characteristics for one pixel, opticalcharacteristics are more securely obtained even in opticalcharacteristics analysis for molecules and DNA where the molecule sizeis contained in a single pixel. (Plural spectra for the same moleculeare obtained by the same pixel.)

Example 11

FIG. 36 illustrates an example of color arrangement of the CMOS imagesensor 1400 having triple-layer photo diode structure illustrated inFIG. 21. This imaging element may be incorporated into the structureillustrated in B in FIG. 30 where insertion or non-insertion of the IRcut filter is selectable. According to the arrangement exampleillustrated in FIG. 36, an upper surface PD 1731 is designed to receiveRGB light as a conventional structure, and a middle surface PD 1732 anda lower surface PD 1733 are designed to receive IR light. The CMOS imagesensor 1400 thus constructed is applicable to the imaging element 1702of the imaging device 1700 illustrated in FIG. 33. In this case, thememory unit 1705 stores respective data of output from the upper surfacePD 1731, output from the middle surface PD 1732, and output from thelower surface PD 1733. The upper surface/lower surface synthesizing unit1707 synthesizes the respective data of the output from the uppersurface PD 1731, the output from the middle surface PD 1732, and thelower surface PD 1733. The upper surface/lower surface synthesizing unit1707 also controls processes required for the synthesis and executed byother processing units. When depth information is desired by usinginfrared light in the imaging device 1700 (FIG. 33) thus constructed,for example, processes are executed in accordance with a signalprocessing flow example shown in FIG. 37.

After the start of the process, the upper surface/lower surfacesynthesizing unit 1707 obtains output of RGB from the upper surface PD1731 of the imaging element 1072 (CMOS image sensor 1400), and estimatesexternal light under which a subject (detection target) is placed instep S1701.

In step S1702, the upper surface/lower surface synthesizing unit 1707determines IR light applied from a not-shown IR light irradiating unitto the subject based on the estimation result obtained in step S1701.The IR light to be applied herein is applied from the electronic device1650 illustrated in FIG. 29 to the subject. For example, the intensityof the IR light is raised when the external light is intensive.Alternatively, the ratios of the respective infrared lights illustratedin FIG. 29 are varied in accordance with the color temperature of thesurrounding light source.

In step S1703, the imaging element 1702 images the subject using theoptimum IR light applied in step S1703, and receives the IR light by themiddle surface PD 1732 and the lower surface PD 1733.

In step S1704, the upper surface/lower surface synthesizing unit 1707individually reads the intensities of lights received by the middlesurface PD 1732 and the lower surface PD 1733 from the memory unit 1705,and determines whether or not the respective values are reliable values(for example, determines whether these values contain much noiseproduced by external light). When it is determined that both the outputfrom the middle surface PD 1732 and the output from the lower surface PD1733 are reliable, the process proceeds to step S1705.

In step S1705, the upper surface/lower surface synthesizing unit 1707synthesizes the output from the middle surface PD 1732 and the outputfrom the lower surface PD 1733.

When it is determined that it is difficult to rely on both the outputfrom the middle surface PD 1732 and the output from the lower surface PD1733 in step S1704, the process proceeds to step S1706.

In step S1706, the upper surface/lower surface synthesizing unit 1707determines whether or not the value of the middle surface PD 1732 isreliable. When it is determined that this value is reliable, the processproceeds to step S1707. In step S1707, the upper surface/lower surfacesynthesizing unit 1707 reads only the pixel value of the middle surfacePD 1732 from the memory unit 1705, and outputs this pixel value.

When it is determined that it is difficult to rely on the output fromthe middle surface PD 1732 in step S1706, the process proceeds to stepS1708.

In step S1708, the upper surface/lower surface synthesizing unit 1707determines whether or not the value of the lower surface PD 1733 isreliable. When it is determined that this value is reliable, the processproceeds to step S1709. In step S1709, the upper surface/lower surfacesynthesizing nit 1707 reads only the pixel value of the lower surface PD1733 from the memory unit 1705, and outputs this pixel value.

When it is determined that it is difficult to rely on the output fromthe lower surface PD 1733 in step S1708, the process returns to stepS1702.

Obviously, there are a lot of possible use examples such as additionreading as well as the foregoing method. By incorporating the imagingelement thus constructed into an electronic device, the accuracy inobtaining depth information increases. Needless to say, this method maybe used for obtaining the foregoing advantages such as colorreproducibility and dynamic range as well as depth information.

Possible application examples of electronic devices include theforegoing medical equipment, a portable communication terminal (smartphone) 1800 illustrated in FIG. 38, a white cane 1820 illustrated inFIG. 39, a camera 1830 illustrated in FIG. 40, a camera mounting table1840 illustrated in FIG. 41, a system unit 1860 illustrated in FIG. 28,and other many examples.

Example 12

As discussed above, the imaging element according to the presenttechnology is applicable to the portable communication terminal 1800illustrated in FIG. 38. For example, a subject is determined by an uppersurface RGB based on colors and shades using the structure illustratedin FIG. 36 (for example, whether it is a hand), and depth information isobtained by IR light receiving units of a middle surface and a lowersurface of an imaging element 1801. This configuration allows theportable communication terminal 1800 to incorporate individual operationcontents performed in accordance with actions, such as raising callvolume (during use of phone) when a human body 1810 (such as hand) comescloser, and lowering of call volume when the human body 1810 (such ashand) goes away. In this case, accurate determination can be made byapplying IR light appropriate for external light as discussed in Example11.

Example 13

The imaging element according to the present technology may beincorporated into the white cane 1820 illustrated in FIG. 39 asdescribed in Japanese Patent Application Laid-Open No. 2010-158472(imaging device 1821). Individual determination of color and depthinformation based on a captured image obtained from the imaging device1821 allows instantaneous determination of an object at the foot, anddanger by vibration or sound of the cane 1820 can be notified, forexample. In this case, accurate determination can be made by applying IRlight appropriate for external light as discussed in Example 11. Inaddition, the imaging element according to the present technology mayreceive particular infrared wavelength light emitted from brailleblocks. In this case, conventional concave-convex type braille blocksmay be eliminated.

Example 14

The imaging element according to the present technology may beincorporated into the camera 1830 (electronic device) illustrated inFIG. 40 as discussed above. The camera 1830 in this example includes animaging unit 1831 and a front display 1832 on the font side with respectto a subject. A display may be provided on the rear side as well.

A self-picture may be taken from a position away from the camera 1830while checking a self-image displayed on the front display 1832. In thiscase, zoom-in and zoom-out, for example, may be executed in response toa self-action (or other actions) by incorporating the imaging elementaccording to the present technology. Similarly, as illustrated in A inFIG. 41, the imaging element according to the present technology may beincorporated into a mounting table 1840 connected with the camera 1830.In this case, an action of a subject is similarly detected by an imagingelement 1841 provided on the mounting table 1840, and instructions ofzoom-in and zoom-out are issued to the camera. Moreover, in addition toinstructions to the camera 1830, a movable unit of the mounting table1840 may be moved in accordance with actions of the subject. Forexample, the direction of the camera 1830 in the horizontal directionand the vertical direction may be varied in accordance with movement ofthe movable unit of the mounting table 1840. For example, the camera1830 may rotate in accordance with movement of the movable unit of themounting table 1840 as illustrated in B in FIG. 41. Alternatively, thecamera 1830 may face up or face down in accordance with movement of themovable unit of the mounting table 1840 as illustrated in C in FIG. 41,for example.

FIG. 42 shows a flow example of signal processing executed for realizingthese. This flow is now described in conjunction with the example shownin FIG. 40.

After the start of the process, the imaging unit 1831 obtains RGB datain step S1801. In step S1802, the imaging unit 1831 determines whetheror not a person is present within an imaging area. When a person ispresent, the process proceeds to step S1803.

In step S1803, the imaging unit 1831 issues an instruction for obtainingIR data (or IR may be simultaneously emitted). In step S1804, theimaging unit 1831 calculates depth information.

In step S1805, the imaging unit 1831 determines whether or not the handof the person is vertically raised. When it is determined that the handis vertically raised, the process proceeds to step S1806.

In step S1806, the camera 1830 executes Operation 1 corresponding to theaction of vertically rise of the hand.

When it is determined that the hand is not vertically raised, theprocess proceeds to step S1807.

In step S1807, the imaging unit 1831 determines whether or not the handis before the face. When it is determined that the hand is positionedbefore the face, the process proceeds to step S1808.

In step S1808, the camera 1830 executes Operation 2 corresponding to theaction of positioning of the hand before the face.

When it is determined that the hand is not positioned before the face,the process proceeds to step S1809.

In step S1809, the camera 1830 executes Operation 3 corresponding to theaction of positioning of the hand not before the face.

Operations 1 to 3 are operations such as zoom operation and shutterdriving.

In case of the example illustrated in FIG. 30, the IR cut filter 1683 isinserted at the time of release of a shutter during the foregoingoperation. A photodiode on an uppermost surface of the presenttechnology obtains high sensitivity characteristics equivalent to thoseof rear surface irradiation; therefore, high-quality still images anddynamic pictures are obtained. Obviously, this method may be used forthe purpose of HDR, high color reproducibility, and light sourceestimation accuracy improvement discussed above, for example. Inaddition, the camera may be of plural-board type such as three-boardtype illustrated in FIG. 43. In other words, the imaging deviceillustrated in FIG. 43 includes imaging element 1851 to imaging element1853 to which the present technology is applied. In this case, lightenters the imaging elements after split into R, G, and B in the previousstage; therefore, the color filter is not required for the imagingelement 1851 to the imaging element 1853. This method may be used forthe purpose of HDR, high color reproducibility, and light sourceestimation accuracy improvement, for example, as in the above example.

Example 15

The imaging element according to the present technology is applicable tothe system unit 1860 (or TV receiver 1862) corresponding to a gameconsole described in JP 2011-507129 W illustrated in FIG. 44 asdiscussed above. For example, the system unit 1860 receives a particularaction as an instruction by determining object, shape, and action of asubject based on an image obtained by a camera 1861, executes processingin correspondence with the instruction, and displays a picture on adisplay (such as TV receiver 1862) in accordance with the processingresult.

By using the imaging element according to the present technology, moreaccurate depth information is obtained as discussed above. Moreover,data obtaining timing is allowed to increase to substantially double byvarying the shutter timing for the upper and lower PDs as discussed inconjunction with FIG. 34. Accordingly, this method is suited for adynamic subject, and therefore appropriate for a game requiring largemotions. Needless to say, data may be read at the same timing, and addedvalues may be used as output. In addition, as discussed in conjunctionwith the flow in FIG. 37, IR light may be determined based on estimationof the light source environment under which the subject is placed, andwhich value of the PDs of the upper surface (or middle surface) and thelower surface is to be used may be determined based on obtained data.Highly accurate detection is achievable by these methods.

FIG. 45 illustrates an example of a block diagram of this type ofelectronic device.

FIG. 45 schematically illustrates a general system architecture of Sony(registered trademark) PlayStation (registered trademark) 3entertainment device, as a computer system which allows the use ofdynamic three-dimensional object mapping for creating user definitioncontroller according to an example of the present technology. A systemunit 1860 is a game console body such as Sony (registered trademark)PlayStation (registered trademark) 3 entertainment device. Variousperipheral devices connectable to the system unit 1860 are provided. Thesystem unit 1860 includes a Cell processor 1901, a Rambus (registeredtrademark) dynamic random access memory (XDRAM) unit 1902, a RealitySynthesizer graphic unit (RSX) 1903 provided with a dedicated videorandom access memory (VRAM) unit 1908, and an I/O bridge 1904. Thesystem unit 1860 further includes a Blu-ray (registered trademark) diskBD-ROM (registered trademark) optical disk reader 1907 accessible viathe I/O bridge 1904 and provided for reading from a disk 1941 and adetachable slot-in hard disk drive (HDD) 1905. The system unit 1860 mayfurther include as an arbitrarily selected component a memory cardreader 1906 similarly accessible via the I/O bridge 1904 and providedfor reading from a compact flash (registered trademark) memory card, amemory stick (registered trademark) memory card and the like.

The I/O bridge 1904 further connects with six universal serial bus (USB)2.0 ports 1912, a Gigabit Ethernet (registered trademark) port 1911,IEEE 802.11b/g wireless network (Wi-Fi) port 1910, and a Bluetooth(registered trademark) wireless link port 1909 supporting sevenBluetooth connections at the maximum.

In operation, the I/O bridge 1904 processes data from all the wireless,USB, and Ethernet (registered trademark) including data from one or moregame controllers 1951. For example, the I/O bridge 1904 receives datafrom the game controller 1951 via the Bluetooth link while a user isplaying the game, and transfers the received data to the Cell processor1901 to update the current state of the game as necessary.

In addition, other peripheral devices 1961 may be connected via therespective ports of the wireless, USB, and Ethernet (registeredtrademark) as well as the game controller 1951. The peripheral devices1961 include a remote controller 1952, a keyboard 1953, a mouse 1954, aportable entertainment device 1955 such as Sony PlayStation portable(registered trademark) entertainment device, a video camera (unit towhich the imaging element of the present technology is applied) such asEyeToy (registered trademark) video camera 1956 (for example, camera1861 illustrated in FIG. 44), and a microphone head set 1957, forexample. Accordingly, these peripheral devices may be connected with thesystem unit 1860 by wireless communication in principle. For example,the portable entertainment device 1955 may communicate via Wi-Fi ad hocconnection, while the microphone head set 1957 may communicate viaBluetooth link.

By providing these interfaces, the PlayStation 3 device may becompatible with digital video recorder (DVR), set top box, digitalcamera, portable media player, VoIP telephone, cellular phone, printer,scanner, and other peripheral devices depending on situations.

Furthermore, an old type memory card reader 1931 is connectable with thesystem unit via the USB port 1912. Thus, a memory card of the type usedby PlayStation (registered trademark) device or PlayStation 2(registered trademark) is allowed to be read.

According to this example, the game controller 1951 is operable forwireless communication with the system unit 1860 via Bluetooth link.Instead, the game controller 1951 may be connected with a USB port sothat power for charging a battery of the game controller 1951 issupplied by this connection. The game controller includes at least oneanalog joystick and conventional control button, and detects shifts of 6degrees of freedom corresponding to translational motions and rotationsin respective axes. Accordingly, a gesture or a shift of a user inaddition to a conventional button or joystick, or in place of theconventional button or joystick, may be converted into input to thegame. Other peripheral devices supporting wireless communication such asa PlayStation portable device may be used as a controller as anarbitrary selection. In case of the PlayStation portable device,additional game information or control information (such as controlinstructions or number of lives) may be presented on a screen of thecorresponding device. An alternative or auxiliary control device may beused, such as dance mat (not shown), light gun, handle and pedal (notshown), and custom-made controller containing one or plural largebuttons for quick answer game (also not shown).

The remote controller 1952 is also operable for wireless communicationwith the system unit 1860 via Bluetooth link. The remote controller 1952is equipped with control suited for operation of Blu-ray disk BDROMreader 1907, and for browsing contents of a disk.

The Blu-ray disk BD-Rom reader 1907 is so operable as to readconventional recorded CD, recordable CD, and so-called super audio CD,and further CD-ROM compatible with PlayStation device and PlayStation 2device. Moreover, the reader 1907 is so operable as to read conventionalrecorded DVD and recordable DVD, and further DVD-ROM compatible withPlayStation 2 device and PlayStation 3 device. Furthermore, the reader1907 is so operable as to read conventional recorded Blu-ray disk andrecordable Blu-ray disk, and further BD-ROM compatible with PlayStation3 device.

The system unit 1860 is operable in such a manner as to supply audio andvideo created or decoded by a PlayStation 3 device via the RealitySynthesizer graphic unit 1903 to an audio output device 1862 (monitor orTV receiver) provided with a display 1921 and one or more speakers 1922via an audio connector and a video connector. The audio connectorcontains conventional analog output and digital output, while the videoconnector may contain outputs of component video, S-video, compositevideo, and one or more high-quality multimedia interface (HDMI(registered trademark)), and other various components. Accordingly, theformat of video output may be PAL or NTSC, or high resolution such as720 p, 1080 i, and 1080 p, for example.

Audio processing (creation, decoding or the like) is executed by theCell processor 1901. The operating system of a PlayStation 3 devicesupports decoding of Dolby (registered trademark) 5.1 surround sound,Dolby (registered trademark) theater surround (DTS), and 7.1 surroundsound from a Blu-ray disk.

According to this example, the video camera 1956 includes one imagingelement (present technology), an LED indicator, and a hardware-basedreal time data compressing and encoding device. This configurationallows transmission of compressed video data in a format appropriate forintra-image-based MPEG (motion picture expert group) standards or thelike for decoding by the system unit 1860. The LED indicator of thecamera is so disposed as to emit light when receiving control datashowing disadvantageous illumination conditions from the system unit1860, for example. An example of the video camera 1956 is connectablewith the system unit 1860 via USB, Bluetooth, or Wi-Fi communicationport by using various methods.

An example of the video camera includes one or more associatedmicrophones, and thus can transmit audio data. The imaging element(present technology) contained in an example of the video camera mayhave resolving power appropriate for video capture with high resolution.During use, an image captured by the video camera may be taken into thegame, or interpreted as control input for the game.

This block diagram shows the display device 1921 and the system unit1860 as separate devices. However, a part or all of these functions maybe incorporated in the display device. In this case, the size of thedisplay device may be a portable size such as the size of a portableterminal.

As described above, the present technology provides photo diodes capableof providing a plurality of spectra for one pixel, and thus providingoutput of plural color components. Moreover, the lamination structuremay be constituted by three or more layers as well as two layers, inwhich structure infrared light is receivable highly effectively.Furthermore, the processes for a rear surface irradiation type imagesensor are utilized, and therefore the photo diode on the on-chip side(upper surface) is highly sensitive. Also, the photo diodes areseparated only by the film thickness of the wiring layer, and, thus, thelower surface photo diode may also be made highly sensitive.

Moreover, formation of an arbitrary substance between the photo diodesis facilitated. For example, a substance having a higher refractiveindex than that of a peripheral wiring part may be provided to functionas a waveguide, thereby realizing high sensitivity of the lower surfacephoto diode. On the other hand, when control of the wavelengthcomponents or the incident light amount is desired, a film absorbing orreflecting a particular wavelength or all wavelengths may be formed.This configuration controls spectrum characteristics of the lowersurface photo diode. Needless to say, the spectrum shape may becontrolled by adjusting the positions of the photo diodes. Improvementof controllability in these manners can be utilized at the time ofindividual reading described in the following 3. Furthermore, the uppersurface and the lower surface may be added for use in a high sensitivitymode, and, thus, various types of operations for one electronic deviceare allowed by switching the mode.

The upper surface and the lower surface photo diodes, and the wiringlayers and transistors for the photo diodes are individuallymanufactured until the upper side and the lower side are joined.Accordingly, processes may be optimized for the respective sides. Inaddition, individual driving is facilitated, and therefore signals maybe individually extracted from the upper surface and lower surface photodiodes. Moreover, shutter timing and electrode accumulation time may beindividually varied. Accordingly, such advantages are offered, whilemaintaining high resolution, which achieve improvement of colorreproducibility, HDR, light source estimation accuracy improvement,depth information obtaining accuracy improvement, healthcare,pathological diagnosis and the like based on analysis of hemoglobin andothers. These technologies are incorporated in electronic devices ormedical equipment provided with an imaging element such as cameramodule, camera, camera for smart phone, endoscope, and capsule endoscopefor miniaturization of these devices, or accuracy increase of thesedevices, or for both.

The present technology offers advantages in case of the conventionalstructure which generates signals only by the upper surface PD as wellas the advantages discussed above. According to a conventional rearsurface irradiation type image sensor illustrated in A in FIG. 46, lighthaving passed through the photo diode may reach the wiring layer, and,thus, the light reflected on the wiring layer causes color mixture withthe adjoining photo diode. However, the configuration according to thepresent technology illustrated in B in FIG. 46 guides light to a deeperlayer, thereby reducing entrance of light reflected by the upper surfacephoto diode. Accordingly, this secondary advantage can be offered evenwhen the lower surface photo diode is not driven.

Obviously, the respective devices discussed herein may includeconfigurations other than the aforementioned configurations. Inaddition, each of the devices may be constituted not only by one device,but also by a system including a plurality of devices.

For allowing execution of a series of the processes discussed herein bysoftware, programs constituting the software are installed via a networkor a recording medium.

This recording medium is constituted by a removable medium providedseparately from the device body to record programs distributed todeliver the programs to a user. Examples of the removable medium includemagnetic disk (including flexible disk), and optical disk (includingCD-ROM and DVD). The examples of the removable medium further includemagneto-optical disk (including MD (Mini Disc)), semiconductor memoryand the like. The recording medium may be constituted not only by theremovable medium, but also by a ROM of a control unit, or a hard diskcontained in a storing unit, as a unit where programs are recorded, andas a unit distributed to a user while incorporated in the device body inadvance.

Programs executed by a computer may be programs where processes areexecuted in time series in the order described in the presentdescription, or programs where processes are executed in parallel, or atthe time of necessity such as at the time of call.

In the present description, the steps for describing programs recordedin the recording medium include, needless to say, processes executed intime series in the order described herein, and further include processesexecuted in parallel or individually regardless of time series.

In the present description, the system refers to the whole apparatusconstituted by a plurality of devices (units).

In the description herein, a configuration discussed as one device (orprocessing unit) may be constituted by a plurality of devices (orprocessing units). Conversely, a constitution discussed as plural deices(or processing units) may be collected as one device (or processingunit). Needless to say, configurations other than the configurationsdiscussed herein may be added to the respective devices (or respectiveprocessing units). A part of the configuration of a certain device (orprocessing unit) may be contained in another device (or anotherprocessing unit) as long as the configurations and actions of the wholesystem are substantially equivalent. Accordingly, the examples of thepresent disclosure are not limited to the examples described herein.Various changes may be made without departing from the subject mattersof the present disclosure.

The present technology may include the following configurations.

(1) An imaging element including:

-   -   a photoelectric conversion element layer containing a        photoelectric conversion element that photoelectrically converts        incident light;    -   a wiring layer formed in the photoelectric conversion element        layer on the side opposite to a light entering plane of the        incident light, and containing a wire for reading charges from        the photoelectric conversion element; and    -   a support substrate laminated on the photoelectric conversion        element layer and the wiring layer, and containing another        photoelectric conversion element.

(2) The imaging element according to (1) described above, wherein thephotoelectric conversion element of the photoelectric conversion elementlayer, and the photoelectric conversion element of the support substratephotoelectrically convert components in different wavelength regions ofthe incident light.

(3) The imaging element according to (2) described above, wherein

-   -   the photoelectric conversion element of the photoelectric        conversion element layer photoelectrically converts components        in a visible light wavelength region, and    -   the photoelectric conversion element of the support substrate        photoelectrically converts components in a near infrared light        wavelength region.

(4) The imaging element according to any of (1) to (3) described above,wherein the thickness of the photoelectric conversion element of thephotoelectric conversion element layer is different from the thicknessof the photoelectric conversion element of the support substrate.

(5) The imaging element according any of (1) to (4) described above,wherein the photoelectric conversion element of the photoelectricconversion element layer and the photoelectric conversion element of thesupport substrate output charges accumulated by photoelectric conversionof the incident light at the same timing.

(6) The imaging element according to any of (1) to (5) described above,wherein the photoelectric conversion element of the photoelectricconversion element layer and the photoelectric conversion element of thesupport substrate output charges accumulated by photoelectric conversionof the incident light at different timing.

(7) The imaging element according any of (1) to (6) described above,wherein the photoelectric conversion element of the photoelectricconversion element layer and the photoelectric conversion element of thesupport substrate output a synthesis image produced by synthesizing animage obtained in the photoelectric conversion element layer and animage obtained in the support substrate by outputting chargesaccumulated by photoelectric conversion of the incident light.

(8) The imaging element according any of (1) to (7) described above,wherein the charge accumulation time of the photoelectric conversionelement of the photoelectric conversion element layer for accumulatingcharges produced by photoelectric conversion of the incident light isdifferent from the corresponding charge accumulation time of thephotoelectric conversion element of the support substrate.

(9) The imaging element according any of (1) to (8) described above,wherein the wire of the wiring layer is disposed in such a position asto secure an optical path of incident light transmitted from one of thesides of the wiring layer to the other side.

(10) The imaging element according to (9) described above, wherein awaveguide formed by material having a larger refractive index than therefractive index of the surroundings is provided on the optical path ofthe wiring layer.

(11) The imaging element according to (9) or (10) described above,wherein a light absorber is provided on the optical path of the wiringlayer.

(12) The imaging element according to any of (1) to (11) describedabove, wherein

-   -   the support substrate further includes a wire formed on the side        of the photoelectric conversion element of the support substrate        opposite to the light entering plane of the incident light for        reading charges from the photoelectric conversion element of the        support substrate, and    -   an external terminal of the wire of the wiring layer and an        external terminal of the wire of the support substrate are        connected with each other by a through via.

(13) The imaging element according to any of (1) to (12) describedabove, wherein, when charges read from the photoelectric conversionelement of the photoelectric conversion element layer exceed apredetermined threshold, charges are read from the photoelectricconversion element of the support substrate.

(14) The imaging element according to any of (1) to (13) describedabove, wherein each of the photoelectric conversion elements includes anorganic photoelectric conversion film.

(15) The imaging element according to any of (1) to (14) described abovefurther includes:

-   -   a white color filter,

wherein

-   -   the photoelectric conversion element of the photoelectric        conversion element layer photoelectrically converts a white        component of the incident light having passed through the white        color filter, and    -   the photoelectric conversion element of the support substrate        photoelectrically converts other color components.

(16) The imaging element according to any of (1) to (15) describedabove, wherein depth information showing a depth to a target is obtainedusing infrared light photoelectrically converted by the photoelectricconversion elements.

(17) The imaging element according to any of (1) to (16) describedabove, wherein it is controlled whether data on the incident lightphotoelectrically converted by the photoelectric conversion element ofthe photoelectric conversion element layer and the photoelectricconversion element of the support substrate is individually output oroutput after addition of the data.

(18) The imaging element according to any of (1) to (17) describedabove, wherein the support substrate includes:

-   -   a photoelectric conversion element layer containing the        photoelectric conversion element of the support substrate,    -   a wiring layer formed in the photoelectric conversion element        layer of the support substrate on the side opposite to a light        entering plane of the incident light, and containing a wire for        reading charges from the photoelectric conversion element of the        support substrate, and    -   a support substrate laminated on the photoelectric conversion        element layer and the wiring layer, and containing another        photoelectric conversion element.

(19) An electronic device including:

-   -   an imaging element that images a subject and includes        -   a photoelectric conversion element layer containing a            photoelectric conversion element that photoelectrically            converts incident light,        -   a wiring layer formed in the photoelectric conversion            element layer on the side opposite to a light entering plane            of the incident light, and containing a wire for reading            charges from the photoelectric conversion element, and        -   a support substrate laminated on the photoelectric            conversion element layer and the wiring layer, and            containing another photoelectric conversion element; and    -   an image processing unit that executes image processing using        signals generated by the photoelectric conversion elements of        the imaging element.

(20) An information processing device including:

-   -   an imaging element that includes:        -   a photoelectric conversion element layer containing a            photoelectric conversion element that photoelectrically            converts incident light,        -   a wiring layer formed in the photoelectric conversion            element layer on the side opposite to a light entering plane            of the incident light, and containing a wire for reading            charges from the photoelectric conversion element, and        -   a support substrate laminated on the photoelectric            conversion element layer and the wiring layer, and            containing another photoelectric conversion element; and    -   a signal processing unit that executes analysis using signals in        a plurality of wavelength bands generated by the photoelectric        conversion elements of the imaging element.

REFERENCE SIGNS LIST

-   100 CMOS image sensor-   111 Condensing lens-   112 Color filter-   113 Insulation film-   114 Semiconductor substrate-   115 Photo diode-   116 Wiring layer-   117 Wire-   118 Wire inlayer film-   119 Passivation film-   120 Wiring layer-   121 Wire-   122 Wire inlayer film-   123 Semiconductor substrate-   124 Photo diode-   125 Support substrate-   131 TSV-   200 Manufacturing device-   201 Control unit-   202 Rear surface irradiation type image sensor manufacturing unit-   203 Front surface irradiation type image sensor manufacturing unit-   204 Assembling unit-   251 Waveguide-   351 Photo diode-   360 Semiconductor substrate-   361 Photo diode-   400 CMOS image sensor-   411 Semiconductor substrate-   412 Photo diode-   413 Wiring layer-   600 Imaging device, CMOS image sensor-   1002 Support substrate-   1021 Photo diode-   1031 Photo diode-   1200 Manufacturing device-   1300 Manufacturing device-   1400 CMOS image sensor-   1600 Imaging device-   1700 Imaging device

What is claimed is:
 1. An imaging element comprising: a photoelectricconversion element layer containing a photoelectric conversion elementthat photoelectrically converts incident light; a wiring layer formed inthe photoelectric conversion element layer on the side opposite to alight entering plane of the incident light, and containing a wire forreading charges from the photoelectric conversion element; and a supportsubstrate laminated on the photoelectric conversion element layer andthe wiring layer, and containing another photoelectric conversionelement.
 2. The imaging element according to claim 1, wherein thephotoelectric conversion element of the photoelectric conversion elementlayer, and the photoelectric conversion element of the support substratephotoelectrically convert components in different wavelength regions ofthe incident light.
 3. The imaging element according to claim 2, whereinthe photoelectric conversion element of the photoelectric conversionelement layer photoelectrically converts components in a visible lightwavelength region, and the photoelectric conversion element of thesupport substrate photoelectrically converts components in a nearinfrared light wavelength region.
 4. The imaging element according toclaim 1, wherein the thickness of the photoelectric conversion elementof the photoelectric conversion element layer is different from thethickness of the photoelectric conversion element of the supportsubstrate.
 5. The imaging element according to claim 1, wherein thephotoelectric conversion element of the photoelectric conversion elementlayer and the photoelectric conversion element of the support substrateoutput charges accumulated by photoelectric conversion of the incidentlight at the same timing.
 6. The imaging element according to claim 1,wherein the photoelectric conversion element of the photoelectricconversion element layer and the photoelectric conversion element of thesupport substrate output charges accumulated by photoelectric conversionof the incident light at different timing.
 7. The imaging elementaccording to claim 1, wherein the photoelectric conversion element ofthe photoelectric conversion element layer and the photoelectricconversion element of the support substrate output a synthesis imageproduced by synthesizing an image obtained in the photoelectricconversion element layer and an image obtained in the support substrateby outputting charges accumulated by photoelectric conversion of theincident light.
 8. The imaging element according to claim 1, wherein thecharge accumulation time of the photoelectric conversion element of thephotoelectric conversion element layer for accumulating charges producedby photoelectric conversion of the incident light is different from thecorresponding charge accumulation time of the photoelectric conversionelement of the support substrate.
 9. The imaging element according toclaim 1, wherein the wire of the wiring layer is disposed in such aposition as to secure an optical path of incident light transmitted fromone of the sides of the wiring layer to the other side.
 10. The imagingelement according to claim 9, wherein a waveguide formed by materialhaving a larger refractive index than the refractive index of thesurroundings is provided on the optical path of the wiring layer. 11.The imaging element according to claim 9, wherein a light absorber isprovided on the optical path of the wiring layer.
 12. The imagingelement according to claim 1, wherein the support substrate furtherincludes a wire formed on the side of the photoelectric conversionelement of the support substrate opposite to the light entering plane ofthe incident light for reading charges from the photoelectric conversionelement of the support substrate, and an external terminal of the wireof the wiring layer and an external terminal of the wire of the supportsubstrate are connected with each other by a through via.
 13. Theimaging element according to claim 1, wherein, when charges read fromthe photoelectric conversion element of the photoelectric conversionelement layer exceed a predetermined threshold, charges are read fromthe photoelectric conversion element of the support substrate.
 14. Theimaging element according to claim 1, wherein each of the photoelectricconversion elements includes an organic photoelectric conversion film.15. The imaging element according to claim 1 further comprising: a whitecolor filter, wherein the photoelectric conversion element of thephotoelectric conversion element layer photoelectrically converts awhite component of the incident light having passed through the whitecolor filter, and the photoelectric conversion element of the supportsubstrate photoelectrically converts other color components.
 16. Theimaging element according to claim 1, wherein depth information showinga depth to a target is obtained using infrared light photoelectricallyconverted by the photoelectric conversion elements.
 17. The imagingelement according to claim 1, wherein it is controlled whether data onthe incident light photoelectrically converted by the photoelectricconversion element of the photoelectric conversion element layer and thephotoelectric conversion element of the support substrate isindividually output or output after addition of the data.
 18. Theimaging element according to claim 1, wherein the support substrateincludes: a photoelectric conversion element layer containing thephotoelectric conversion element of the support substrate, a wiringlayer formed in the photoelectric conversion element layer of thesupport substrate on the side opposite to a light entering plane of theincident light, and containing a wire for reading charges from thephotoelectric conversion element of the support substrate, and a supportsubstrate laminated on the photoelectric conversion element layer andthe wiring layer, and containing another photoelectric conversionelement.
 19. An electronic device comprising: an imaging element thatimages a subject and includes a photoelectric conversion element layercontaining a photoelectric conversion element that photoelectricallyconverts incident light, a wiring layer formed in the photoelectricconversion element layer on the side opposite to a light entering planeof the incident light, and containing a wire for reading charges fromthe photoelectric conversion element, and a support substrate laminatedon the photoelectric conversion element layer and the wiring layer, andcontaining another photoelectric conversion element; and an imageprocessing unit that executes image processing using signals generatedby the photoelectric conversion elements of the imaging element.
 20. Aninformation processing device comprising: an imaging element thatincludes: a photoelectric conversion element layer containing aphotoelectric conversion element that photoelectrically convertsincident light, a wiring layer formed in the photoelectric conversionelement layer on the side opposite to a light entering plane of theincident light, and containing a wire for reading charges from thephotoelectric conversion element, and a support substrate laminated onthe photoelectric conversion element layer and the wiring layer, andcontaining another photoelectric conversion element; and a signalprocessing unit that executes analysis using signals in a plurality ofwavelength bands generated by the photoelectric conversion elements ofthe imaging element.